Zobrazeno 1 - 10
of 757
pro vyhledávání: '"substrate noise"'
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. Apr2018, Vol. 8 Issue 4, p660-669. 10p.
Publikováno v:
International Journal of RF & Microwave Computer-Aided Engineering. Jan2011, Vol. 21 Issue 1, p36-44. 9p. 1 Color Photograph, 3 Diagrams, 11 Graphs.
Autor:
Shagaev, V. V.1 shagaev_vv@rambler.ru
Publikováno v:
Technical Physics. Mar2008, Vol. 53 Issue 3, p353-356. 4p. 1 Chart, 1 Graph.
Autor:
Agarry, S.E.1 (AUTHOR) sam_agarry@yahoo.com, Solomon, B.O.2 (AUTHOR)
Publikováno v:
Bioremediation Journal. Jan-Mar2008, Vol. 12 Issue 1, p13-20. 9p. 2 Charts, 5 Graphs.
Autor:
Moursy, Yasser1, Zou, Hao1, Khalil, Raouf1, Iskander, Ramy1, Tisserand, Pierre2, Ton, Dieu-My2, Pasetti, Giuseppe3, Louerat, Marie-Minerve1
Publikováno v:
IEEE Transactions on Power Electronics. Jul2017, Vol. 32 Issue 7, p5550-5559. 10p.
Autor:
Araga, Yuuki1, Nagata, Makoto1, Van der Plas, Geert2, Marchal, Paul2, Libois, Michael2, Manna, Antonio La2, Zhang, Wenqi2, Beyer, Gerald2, Beyne, Eric2
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. Jun2014, Vol. 4 Issue 6, p1026-1037. 12p.
This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation stru
Autor:
Gu, Xiaoxiong1, Silberman, Joel A.1, Young, Albert M.1, Jenkins, Keith A.1, Dang, Bing1, Liu, Yong1, Duan, Xiaomin2, Gordin, Rachel3, Shlafman, Shlomo3, Goren, David1
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. Nov2013, Vol. 3 Issue 11, p1917-1925. 9p.