Zobrazeno 1 - 10
of 52
pro vyhledávání: '"solder interconnection"'
Autor:
Maria Abu Bakar, Mohd Ariffin Ambak, Najib Saedi Ibrahim, Mohd Zulkifly Abdullah, Azman Jalar
Publikováno v:
Sains Malaysiana. 47:2157-2162
Bahan aloi pateri dalam kumpulan Sn-Ag-Cu (SAC) merupakan bahan pematerian yang bebas plumbum digunakan secara meluas dalam industri elektronik. Antarasambungan pateri bertindak untuk menghubungkan komponen elektronik pada papan litar bercetak (PCB).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05279bb563e0cedd8245d069ebf70ffb
https://doi.org/10.17576/jsm-2018-4709-25
https://doi.org/10.17576/jsm-2018-4709-25
Publikováno v:
Journal of Electronic Materials. 43:4090-4102
In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection compositions (Sn-3.1Ag-0.52Cu, Sn-3.0Ag-0.52Cu-0.24Bi, and Sn-1.1Ag-0.52Cu-0.1Ni) was compared under mechanical shock loading (JESD22-B111 standard) and cyclic therm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7bd2effbde50b07f72cb1cc2c79366dd
https://doi.org/10.1007/s11664-014-3298-8
https://doi.org/10.1007/s11664-014-3298-8
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 13:167-176
The effect of concurrent vibration and electrical power loads on the solder interconnections of a surface-mount power transistor package has been investigated in this work. Both cyclic and constant power loadings were separately combined with vibrati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::04cff35a9f6f269e8d4888e427c6b392
https://doi.org/10.1109/tdmr.2012.2226462
https://doi.org/10.1109/tdmr.2012.2226462
Autor:
Dongkai Shangguan, Hao Yu
Publikováno v:
Soldering & Surface Mount Technology. 25:31-38
PurposeAs a literature review article, the purpose of this paper is to highlight the intricate interaction and correlation between the interconnection microstructure and the failure mechanism. It is therefore critical to summarize all the challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f365ed77fc390d178003bf7aa7c20c7
https://doi.org/10.1108/09540911311294632
https://doi.org/10.1108/09540911311294632
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
One of the most favour components, which are mounted on the printed circuit board (PCB), is Ball Grid Array (BGA) due to higher integration. On the other hand BGAs are components which are the most problematic from point of solder interconnection rel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd86b62bec656535fd9823dbf458b3e9
https://doi.org/10.1109/isse.2016.7563190
https://doi.org/10.1109/isse.2016.7563190
Publikováno v:
JOURNAL OF ELECTRONIC MATERIALS. 41(11):3232-3246
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=CSC_________::f13c55132d693be02c26287389220952
http://juuli.fi/Record/0338965212
http://juuli.fi/Record/0338965212
Publikováno v:
Microelectronics Reliability. 51:425-436
This article presents a method for estimating solder interconnection failure times based on nonlinear parameter estimation techniques in conjunction with the Levenberg–Marquardt Algorithm (LMA). The LMA algorithm is applied to precursor measurement
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5dd2eec458b63647f552ca16fbaf2398
https://doi.org/10.1016/j.microrel.2010.08.007
https://doi.org/10.1016/j.microrel.2010.08.007
Autor:
Arvind K. Sinha, Kevin M. O'Connell
Publikováno v:
International Symposium on Microelectronics. 2011:000690-000693
Hot and cold solder ball pull testing has emerged as an attractive alternative to the traditional ball shear method for characterizing the attachment strength of solder interconnection. This paper describes the effects of aging with relative humidity
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5afdd8e357e3ff92e4f6fea7d5786d3
https://doi.org/10.4071/isom-2011-wp2-paper1
https://doi.org/10.4071/isom-2011-wp2-paper1
Autor:
Xuwen Liu, Maik Mueller, Hongtao Chen, Klaus-Juergen Wolter, Jue Li, Tonu Tuomas Mattila, Mervi Paulasto-Kröckel
Publikováno v:
JOURNAL OF MATERIALS RESEARCH. 26(16):2103-2116
The failure mechanism of lead-free solder interconnections of chip scale package–sized Ball Grid Array (BGA) component boards under thermal cycling was studied by employing cross-polarized light microscopy, scanning electronic microscopy, electron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b61832b13da888f7648d7b5ebfcb74fb
http://juuli.fi/Record/0339056011
http://juuli.fi/Record/0339056011
Publikováno v:
Microelectronics Reliability. 50(8):1125-1133
Portable electronic products such as mobile phones experience various loadings in their use environments but accidental drops are encountered most frequently. Over the past few years the drop reliability of electronic assemblies has been studied by m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3de65fb378dea39bac18a778312c1948
http://juuli.fi/Record/0340146710
http://juuli.fi/Record/0340146710