Zobrazeno 1 - 2
of 2
pro vyhledávání: '"silver epoxy adhesive"'
Publikováno v:
Polymers, Vol 15, Iss 10, p 2338 (2023)
With the miniaturization of electronic devices, electronic packaging has become increasingly precise and complex, which presents a significant challenge in terms of heat dissipation. Electrically conductive adhesives (ECAs), particularly silver epoxy
Externí odkaz:
https://doaj.org/article/00da709753974267a48349c9727181b0
Autor:
E Y; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China., Tian Z; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.; Baopeng New Materials Technology Co., Ltd., Shenzhen 518055, China.; Southern Institute of Industrial Technology, Shenzhen 518055, China., Chi K; Foshan (Southern China) Institute for New Materials, Foshan 528000, China., Jiang R; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China., Lv Y; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China., Sun Q; Foshan (Southern China) Institute for New Materials, Foshan 528000, China., Zhu Y; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.
Publikováno v:
Polymers [Polymers (Basel)] 2023 May 17; Vol. 15 (10). Date of Electronic Publication: 2023 May 17.