Zobrazeno 1 - 10
of 620
pro vyhledávání: '"shock test"'
Autor:
Yongqi Zhang, Zeshan Abbas, Lun Zhao, Zhonghua Shen, Liya Li, Jianxiong Su, Saad Saleem Khan, Stephen Larkin
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-18 (2024)
Abstract Based on the ultrasonic welding technology, this study uses three different welding widths to weld copper cables with different specifications. The influence of welding width on the mechanical properties and microstructure of each group of w
Externí odkaz:
https://doaj.org/article/f00f7064ac124f3fa09b0ead599c46eb
Numerical study on flow and heat transfer of combustion chamber and turbine under thermal shock test
Publikováno v:
Case Studies in Thermal Engineering, Vol 63, Iss , Pp 105345- (2024)
In order to more accurately analyze the influence of the interaction between the aero-engine combustion chamber and the turbine, this paper establishes a combustion chamber-turbine cross-component model based on a high-pressure first-stage guide vane
Externí odkaz:
https://doaj.org/article/12f01622988248c4b0a92d1edcfeba7b
Publikováno v:
Heliyon, Vol 10, Iss 19, Pp e38464- (2024)
Lead-cone waveform generator (LCWG) is one of the crucial components in shock tests to generate final-peak saw-tooth shock pulses which are widely used to evaluate the safety and reliability of structure/equipment under shock environment in laborator
Externí odkaz:
https://doaj.org/article/430f1846e61f4f1283e2d69a846d7f32
Autor:
Erhan Ozkan
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-17 (2024)
Abstract The main purpose of this study is to investigate the mechanical shock behavior and develop the shock resistance of widely preferred butterfly valves for navy defense industries by handling the real test results with computer aided design and
Externí odkaz:
https://doaj.org/article/fb01dcf49bb643ebbeb9b2da35077351
Publikováno v:
Journal of Materials Research and Technology, Vol 26, Iss , Pp 1663-1668 (2023)
With the rapid development of 3D packaging, it is of great practical significance to understand the failure mechanism of solder joints in heterogeneous integration devices. In this study, the grain orientation and microstructure evolution of SAC305 s
Externí odkaz:
https://doaj.org/article/69b4383ed465427ea62892cd0b77e0ae
Autor:
Yuxin Xu, Xiaoming Qiu, Wangyun Li, Suyu Wang, Ninshu Ma, Minoru Ueshima, Chuantong Chen, Katsuaki Suganuma
Publikováno v:
Journal of Materials Research and Technology, Vol 26, Iss , Pp 1079-1093 (2023)
Diamond has the highest thermal conductivity among naturally occurring materials and a relatively low coefficient of thermal expansion (CTE), making it a promising interconnected material for next-generation semiconductor power devices. In this study
Externí odkaz:
https://doaj.org/article/ae4c6e2d42d34e71bc6222002db58b1e
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 90, Iss 929, Pp 23-00254-23-00254 (2023)
Marman clamp band separation mechanism is often used to separate a satellite from a launch vehicle. During the separation, the Marman clamp band releases its clamped force and to expose the satellite to a harsh environment of high-magnitude accelerat
Externí odkaz:
https://doaj.org/article/711d731ee1364b82a7d808446e6d4341
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