Zobrazeno 1 - 7
of 7
pro vyhledávání: '"rtMLF"'
Publikováno v:
Microelectronics International, 2023, Vol. 40, Issue 2, pp. 159-165.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MI-10-2022-0175
Publikováno v:
Journal of Advanced Joining Processes, Vol 5, Iss , Pp 100102- (2022)
As components get closer together and more devices are integrated into a package, electromagnetic interference (EMI) is one of the most common concerns to be addressed. EMI shielding is not a new topic and its technology has widely been applied to co
Externí odkaz:
https://doaj.org/article/311dc4b474904e9f97797cf92e5d1538
Akademický článek
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Conference
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Publikováno v:
Microelectronics International. 40:159-165
Purpose The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the continuous market requirement. Because of demand and trends, new packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::010d7cd958b13a8d6c37086ea22359d5
https://doi.org/10.1108/mi-10-2022-0175
https://doi.org/10.1108/mi-10-2022-0175
Autor:
Kim, Byong Jin1,2 (AUTHOR), Jeon, HyeongIl1 (AUTHOR), Kim, GiJeong1 (AUTHOR), Cho, Nam-Hee2 (AUTHOR), Khim, JinYoung1 (AUTHOR), Kim, Yeong K.1,3 (AUTHOR) ykkim@inha.ac.kr
Publikováno v:
Microelectronics Reliability. Aug2022, Vol. 135, pN.PAG-N.PAG. 1p.
Publikováno v:
Journal of the Microelectronics and Packaging Society. 22:41-45
RtMLF (Routable Molded Lead Frame) based on molded substrate has been developed to maximize advantages of both leadframe product which has high thermal and electrical performance and laminate product which accommodates more I/O count and keeps fan-in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3605a0ce28e6ed7d14ce92f7b87ccdf8
https://doi.org/10.6117/kmeps.2015.22.2.041
https://doi.org/10.6117/kmeps.2015.22.2.041