Zobrazeno 1 - 10
of 62
pro vyhledávání: '"power supply on chip"'
Publikováno v:
Micromachines, Vol 15, Iss 2, p 228 (2024)
The paper reports on high voltage (HV)-isolated MEMS quad–solenoid transformers for compact isolated gate drivers and bias power supplies. The component is wafer-level fabricated via a novel MEMS micro-casting technique, where the tightly coupled q
Externí odkaz:
https://doaj.org/article/a1d392b7ba854bd3876eb1575e205645
Autor:
Chandra Shetty, Daniel C. Smallwood
Publikováno v:
IEEE Access, Vol 10, Pp 92105-92127 (2022)
A solution architecture for monolithic system-on-chip (SoC) power conversion is in high demand to enable modern electronics with a reduced footprint and increased functionality. A promising solution is to reduce the microinductor size by using novel
Externí odkaz:
https://doaj.org/article/7d31f9b8b39a4ec5a9b028e46895a62e
Autor:
Chandra Shetty
Publikováno v:
Power Electronic Devices and Components, Vol 2, Iss , Pp 100006- (2022)
This work presents the impact of design parameters such as the number of turns, pitch, height, conductor dimensions, etc., on the dc ratio of inductance to resistance (Ldc/Rdc) (also known as dc quality factor Qdc) of 3D micro air-core inductors. We
Externí odkaz:
https://doaj.org/article/69df5313875c482fae2772e0df91ade8
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Don Tan
Publikováno v:
Eletrônica de Potência, Vol 25, Iss 4 (2020)
This paper attempts to summarize 10 major contemporary challenges for power electronics and system technology (PEAS technology). Historical background is first reviewed together with most recent technological advances. Recent advances are then discus
Externí odkaz:
https://doaj.org/article/8048c11f846d4821b7c597bc9a7e2167
Autor:
Ruaidhrí Murphy, Pablo Zumel, Séamus O’Driscoll, Zoran Pavlovic, Cristina Fernández, Cian O'Mathuna, Jaime Lopez Lopez
Publikováno v:
e-Archivo. Repositorio Institucional de la Universidad Carlos III de Madrid
instname
instname
Present needs in efficiency and integration drive research toward the miniaturization of power converters. Among the latest components to achieve the desired degree of integration are cored micro-inductors that are still one of the hardest devices to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8d80fbb9bbd1abfee5402c4d555a21dd
https://doi.org/10.1109/jestpe.2021.3094631
https://doi.org/10.1109/jestpe.2021.3094631
Autor:
Kandeel, Youssef
Power electronic circuits are a key player in many essential electrical systems and applications, e.g., power converters. For computational and battery-powered consumer products, the desire for higher power densities and longer battery life increases
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1513::5bac741fb00a4815f3c695052aaed531
http://hdl.handle.net/10379/17355
http://hdl.handle.net/10379/17355
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
3D power supply on chip (3D power SoC), which integrates Si based IC, Gallium Nitride (GaN) power devices and passive devices realizes high efficiency at high frequency switching and high-power density. Miniaturization makes 3D power SoC high tempera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d23e0d953c0e434f65931b68df152ed8
https://doi.org/10.23919/icep55381.2022.9795434
https://doi.org/10.23919/icep55381.2022.9795434
Autor:
Yu, Xuehong
The objective of the proposed research is to design, fabricate, characterize and test silicon-embedded magnetic components for on-chip integrated power applications. Driven by the trend towards continued system multi-functionality and miniaturization
Externí odkaz:
http://hdl.handle.net/1853/54243
Publikováno v:
Journal of the Institute of Industrial Applications Engineers. 8(1):1-7
Power-SoC, which integrates MCU, power device, control circuits and passive devices on the same chip has been attracted attention. In this paper, we discuss the impact of passive component structure for high efficiency and fast response POL using 3D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b62db4e099b04eba994505fcace90f04
https://kyutech.repo.nii.ac.jp/records/6459
https://kyutech.repo.nii.ac.jp/records/6459