Zobrazeno 1 - 7
of 7
pro vyhledávání: '"pájitelnost"'
This paper deals with solderability of thick printed copper substrates using formic acid vapours in combination with vacuum soldering technology. The topic of low void, preferably void free joints in the field of electronics is important, because of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::9bde5273ed2500b4d3d15d2c259a6c9b
http://hdl.handle.net/11025/36525
http://hdl.handle.net/11025/36525
This paper is focused on an adhesion and solderability measuring of samples prepared by TPC (Thick Printed Copper) technology. The TPC technology is used for power electronic substrate manufacturing. Copper film is screen printed on alumina substrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::315fd43d7c606ed5e7ba2ecc8ac8ed1e
http://hdl.handle.net/11025/26507
http://hdl.handle.net/11025/26507
This article will present results of activity testing of rosin fluxes. A good solderability of a component output and a soldering pad of PCB are important for the creation of a quality joint. Since it supports a melted solder wetting on a soldered su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::15942b489b6d04fa8ef82f7382aca7e0
http://hdl.handle.net/11025/6623
http://hdl.handle.net/11025/6623
The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded aut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::a62d0b4fa0f250c85cd4ad4df4f0116f
http://hdl.handle.net/11025/536
http://hdl.handle.net/11025/536
Autor:
Novák, Tomáš
The article deals with solderability testing in the inert atmosphere. The article also includes comparison of tested samples and the influence of the inert atmosphere. By reason of implementation of inert atmosphere into the soldering process it is n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::bd4125ffdfc7792101ee55de1b07862b
http://hdl.handle.net/11025/498
http://hdl.handle.net/11025/498
Autor:
Harant, Petr, Steiner, František
Článek pojednává o pájitelnosti a o jejím testování. Pájitelnost je vysvětlena coby důležitá vlastnost povrchů, které mají být spojeny strojním pájením. Příspěvek je zaměřen na testování pájitelnosti měřením časového
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::26c60244d28f91782e32cf6393ce2ae8
http://hdl.handle.net/11025/392
http://hdl.handle.net/11025/392