Zobrazeno 1 - 10
of 480
pro vyhledávání: '"orthogonal regression"'
Publikováno v:
Heliyon, Vol 10, Iss 23, Pp e40243- (2024)
To enhance the carbonation resistance of reclaimed concrete, several key factors affecting its performance were investigated. An orthogonal array L16(4³ × 2⁶) was employed to design the carbonation tests for steel fiber (SF) reinforced concrete.
Externí odkaz:
https://doaj.org/article/9f39d666f0e54489824d8233bd3e743d
Publikováno v:
In Heliyon 15 December 2024 10(23)
Publikováno v:
IEEE Access, Vol 12, Pp 150105-150113 (2024)
In embedded feature selection methods, one criterion for evaluating features is the Feature Contribution to Each Class (FCEC). Unlike traditional feature contribution, it focuses more on the ability of features to represent each class, aiding in unde
Externí odkaz:
https://doaj.org/article/4633d5987df547bcba8470a48432b1e1
Publikováno v:
Geoenvironmental Disasters, Vol 10, Iss 1, Pp 1-11 (2023)
Abstract Background The initial phase of earthquake hazard assessment involves the consolidation of diverse magnitude scales, thereby requiring the homogenization of various magnitudes. Moment magnitude (Mw) emerges as the preferred descriptor for a
Externí odkaz:
https://doaj.org/article/84c877f6d12f439e96073765290944f3
Autor:
Stan Lipovetsky
Publikováno v:
Stats, Vol 6, Iss 3, Pp 889-906 (2023)
This study considers the statistical estimation of relations presented by implicit functions. Such structures define mutual interconnections of variables rather than outcome variable dependence by predictor variables considered in regular regression
Externí odkaz:
https://doaj.org/article/94441338ddfc47e29c68f40d2ee4dea9
Publikováno v:
In Journal of Rock Mechanics and Geotechnical Engineering November 2024
Autor:
Saravanan V, Swapna S. L
Publikováno v:
Jordanian Journal of Computers and Information Technology, Vol 9, Iss 1, Pp 63-75 (2023)
The Internet of Things (IoT) is a collection of interconnected intelligent devices that exists within the larger network known as the Internet. With the increasing popularity of IoT devices, massive data is generated day by day. The collected data ne
Externí odkaz:
https://doaj.org/article/f4fbf03b7d17432da3a6cfe3d1e2b12a
Akademický článek
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Akademický článek
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Publikováno v:
SN Applied Sciences, Vol 4, Iss 10, Pp 1-11 (2022)
Abstract Wafer dicing saw is one of the core equipment in the manufacturing process of semiconductor integrated circuit components. The cutting accuracy of dicing saw directly affects the overall quality of processed chips. This paper systematically
Externí odkaz:
https://doaj.org/article/be943842df054acaaa8b78281ec4a3d9