Zobrazeno 1 - 10
of 3 446
pro vyhledávání: '"optical interconnect"'
Autor:
Francesco Amanti, Greta Andrini, Fabrizio Armani, Fabrizio Barbato, Vittorio Bellani, Vincenzo Bonaiuto, Simone Cammarata, Matteo Campostrini, Thu Ha Dao, Fabio De Matteis, Valeria Demontis, Simone Donati, Giovanni Di Giuseppe, Sviatoslav Ditalia Tchernij, Andrea Fontana, Jacopo Forneris, Luca Frontini, Roberto Gunnella, Simone Iadanza, Ali Emre Kaplan, Cosimo Lacava, Valentino Liberali, Leonardo Martini, Francesco Marzioni, Luca Morescalchi, Elena Pedreschi, Paolo Piergentili, Domenic Prete, Valentino Rigato, Carlo Roncolato, Francesco Rossella, Matteo Salvato, Fausto Sargeni, Jafar Shojaii, Franco Spinella, Alberto Stabile, Alessandra Toncelli, Valerio Vitali
Publikováno v:
Photonics, Vol 11, Iss 6, p 494 (2024)
Integrated photonics on Silicon-On-Insulator (SOI) substrates is a well developed research field that has already significantly impacted various fields, such as quantum computing, micro sensing devices, biosensing, and high-rate communications. Altho
Externí odkaz:
https://doaj.org/article/5b5bc252f2ae45e29ed986d5dce3905a
Autor:
Niu Jiaqi, Yang Shanglin, Zhou Ting, Jia Hao, Fu Xin, Zhao Zhizun, Li Zhen, Zhang Gaolu, Chen Changhua, Yang Lin
Publikováno v:
Nanophotonics, Vol 11, Iss 21, Pp 4869-4878 (2022)
Silicon-based optical switch is one of the key components for on-chip optical interconnect systems, and mode division multiplexing technology has been employed to boost optical switches’ channel capacity. However, the majority of the proven multimo
Externí odkaz:
https://doaj.org/article/620e4ec71b8d4b3192668dfc1f4a2d14
Publikováno v:
Photonics, Vol 11, Iss 1, p 15 (2023)
We present a high-efficiency silicon grating coupler design based on a left–right mirror-symmetric grating and a metal mirror. The coupler achieves nearly perfect 90-degree vertical coupling. When two SOI chips are placed face to face with a vertic
Externí odkaz:
https://doaj.org/article/ab64339ff061429ab8115f62fec58d6b
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Binhao Wang, Jifang Mu
Publikováno v:
PhotoniX, Vol 3, Iss 1, Pp 1-22 (2022)
Abstract High-speed optical interconnects of data centers and high performance computers (HPC) have become the rapid development direction in the field of optical communication owing to the explosive growth of market demand. Currently, optical interc
Externí odkaz:
https://doaj.org/article/b17f7b8b6bc44ea08fd56f26608e18ab
Autor:
Yuexin Yin, Chunlei Sun, Yingzhi Ding, Xinru Xu, Mengke Yao, Lan Li, Hongtao Lin, Daming Zhang
Publikováno v:
IEEE Photonics Journal, Vol 14, Iss 4, Pp 1-9 (2022)
To achieve complex functionality with small size, weight and power, photonic integrated circuits (PIC) are expanded from two-dimensional (2D) to three-dimensional (3D). In this paper, a new design for a scalable 3D silicon optical switch is proposed.
Externí odkaz:
https://doaj.org/article/a4fb594e82e3418a9049711d61105060
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Yuan-Zeng Lin, Chi-Wai Chow, Tien-Wei Yu, Yin-He Jian, Tun-Yao Hung, Jian-Wen Chen, Chien-Hung Yeh
Publikováno v:
Sensors, Vol 23, Iss 16, p 7259 (2023)
We put forward and demonstrate a silicon photonics (SiPh)-based mode division multiplexed (MDM) optical power splitter that supports transverse-electric (TE) single-mode, dual-mode, and triple-mode (i.e., TE0, TE1, and TE2). An optical power splitter
Externí odkaz:
https://doaj.org/article/162a3c5d1e0b4a3ebb73f6a66e998a23
Autor:
Qian Zhang, Sujay Charania, Stefan Rothe, Nektarios Koukourakis, Niels Neumann, Dirk Plettemeier, Juergen W. Czarske
Publikováno v:
Sensors, Vol 23, Iss 13, p 6076 (2023)
Following Moore’s law, the density of integrated circuits is increasing in all dimensions, for instance, in 3D stacked chip networks. Amongst other electro-optic solutions, multimode optical interconnects on a silicon interposer promise to enable h
Externí odkaz:
https://doaj.org/article/ca490fd5056243f1a5d89d81b782c78c
Autor:
Tien-Wei Yu, Chi-Wai Chow, Pin-Cheng Kuo, Yuan-Zeng Lin, Tun-Yao Hung, Yin-He Jian, Chien-Hung Yeh
Publikováno v:
Photonics, Vol 10, Iss 7, p 759 (2023)
To increase the optical interconnect transmission capacity, different multiplexing technologies, including wavelength division multiplexing (WDM), polarization division multiplexing (PolDM) and mode division multiplexing (MDM), can be utilized. Among
Externí odkaz:
https://doaj.org/article/40e465c1f098414ba08d91d885b99528