Zobrazeno 1 - 2
of 2
pro vyhledávání: '"multichip silicon carbide power module"'
Publikováno v:
The Journal of Engineering (2019)
In this study, a three-dimensional model with multi-parameter order reduction is applied to the thermal modelling of power electronics modules with complex geometries. Finite element or finite difference method can be used to establish accurate mathe
Externí odkaz:
https://doaj.org/article/8c19fc6e717346ce8f486c293513879c
Publikováno v:
The Journal of Engineering (2019)
In this study, a three-dimensional model with multi-parameter order reduction is applied to the thermal modelling of power electronics modules with complex geometries. Finite element or finite difference method can be used to establish accurate mathe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a99dacd0ee728e8fd63b9a88f1459e22
https://doi.org/10.1049/joe.2018.8094
https://doi.org/10.1049/joe.2018.8094