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pro vyhledávání: '"modeling tool"'
The rapid evolution of Large Language Models (LLMs) has unlocked new possibilities for applying artificial intelligence across a wide range of fields, including privacy engineering. As modern applications increasingly handle sensitive user data, safe
Externí odkaz:
http://arxiv.org/abs/2410.08755
Autor:
Jaraiz, Martin, Pinacho, Ruth
We present recent progress in the design and development of DEPLOYERS, an agent-based macroeconomics modeling (ABM) framework, capable to deploy and simulate a full economic system (individual workers, goods and services firms, government, central an
Externí odkaz:
http://arxiv.org/abs/2409.04876
We present a computational tool, TweedleDEE, for empirically modeling diffuse gamma-ray background emission in a 1 degree region of the sky, using publicly available gamma-ray data slightly off-axis from this region. This background model allows a us
Externí odkaz:
http://arxiv.org/abs/2408.04611
Publikováno v:
ISPASS 2024 pp. 10-23
Compute-In-Memory (CiM) is a promising solution to accelerate Deep Neural Networks (DNNs) as it can avoid energy-intensive DNN weight movement and use memory arrays to perform low-energy, high-density computations. These benefits have inspired resear
Externí odkaz:
http://arxiv.org/abs/2405.07259
Autor:
Ruscone, Marco, Checcoli, Andrea, Heiland, Randy, Barillot, Emmanuel, Macklin, Paul, Calzone, Laurence, Noël, Vincent
Multiscale models provide a unique tool for studying complex processes that study events occurring at different scales across space and time. In the context of biological systems, such models can simulate mechanisms happening at the intracellular lev
Externí odkaz:
http://arxiv.org/abs/2406.18371
Akademický článek
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Akademický článek
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Autor:
Cerotti, Davide1,2 (AUTHOR) davide.cerotti@uniupo.it, Codetta Raiteri, Daniele1,2 (AUTHOR) daniele.codetta@uniupo.it, Dondossola, Giovanna3 (AUTHOR) giovanna.dondossola@rse-web.it, Egidi, Lavinia1 (AUTHOR) lavinia.egidi@uniupo.it, Franceschinis, Giuliana1,2 (AUTHOR) giuliana.franceschinis@uniupo.it, Portinale, Luigi1,2 (AUTHOR), Savarro, Davide4 (AUTHOR) davide.savarro@unito.it, Terruggia, Roberta3 (AUTHOR) roberta.terruggia@rse-web.it
Publikováno v:
Energies (19961073). Aug2024, Vol. 17 Issue 16, p3882. 30p.
Environmental sustainability is crucial for Integrated Circuits (ICs) across their lifecycle, particularly in manufacturing and use. Meanwhile, ICs using 3D/2.5D integration technologies have emerged as promising solutions to meet the growing demands
Externí odkaz:
http://arxiv.org/abs/2307.08060