Zobrazeno 1 - 1
of 1
pro vyhledávání: '"low-t g adhesive"'
Publikováno v:
Organic Materials, Vol 5, Iss 01, Pp 66-71 (2023)
Abstract Lamination of a thin film encapsulation (TFE) layer is regarded as one of the most promising methods that enable the reliable operation of organic electronic devices by attaching the TFE layers thereon directly using an adhesive layer. In t
Externí odkaz:
https://doaj.org/article/ae91803578304fa8805efa1ab485bd5a
