Zobrazeno 1 - 10
of 35
pro vyhledávání: '"lou, Huafen"'
Publikováno v:
In Materials Characterization December 2024 218 Part 1
Autor:
Wang, Lijuan, Meng, Xiangpeng, Jiang, Yanbin, Wang, Meng, Zhang, Jia’ning, Tang, Ning, Mo, Yongda, Xiao, Zhu, Lou, Huafen, Dai, Can, Li, Zhou
Publikováno v:
In Journal of Alloys and Compounds 15 November 2024 1005
Autor:
Chen, Ruxuan, Lei, Qian, Wang, Yunpeng, Wang, Yihan, Zhou, Shuang, Liu, Fang, Xiang, Chaojian, Mo, Yongda, Lou, Huafen
Publikováno v:
In Materials Characterization November 2024 217
Publikováno v:
In Materials Characterization November 2024 217
Autor:
Yang, Kuo, Guo, Mingxing, Wang, Hu, Wang, Miaomiao, Mo, Yongda, Wang, Yunpeng, Liu, Fang, Liang, Dong, Lou, Huafen
Publikováno v:
In Materials Science & Engineering A November 2024 915
Autor:
Du, Jinqing, Guo, Mingxing, Wang, Tongbo, Chen, Xiangyang, Qiao, Dexian, Zhou, Wei, Zhuang, Linzhong, Lou, Huafen
Publikováno v:
In Materials Characterization October 2024 216
Autor:
Xiang, Chaojian, Li, Xiaojun, Mo, Yongda, Chen, Zhongping, Wang, Hu, Xiao, Zhu, Gong, Shen, Li, Zhou, Lou, HuaFen
Publikováno v:
In Materials Science & Engineering A October 2024 912
Autor:
Wang, Lijuan, Meng, Xiangpeng, Zhang, Jianing, Wang, Meng, Huang, Chengzhi, Wang, Xu, Jiang, Yanbin, Tang, Ning, Mo, Yongda, Xiao, Zhu, Lou, Huafen, Li, Zhou
Publikováno v:
In Materials Science & Engineering A July 2024 904
Akademický článek
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Publikováno v:
中国工程科学, Vol 25, Iss 1, Pp 96-103 (2023)
Copper and copper-based materials are widely applied to power electronics, automobile, and mechanical manufacturing as well as to high-tech manufacturing fields such as aeronautics, astronautics, telecommunications, and integrated circuits owing to t
Externí odkaz:
https://doaj.org/article/b9a33756121241e8a4d658d1eb65555a