Zobrazeno 1 - 10
of 5 920
pro vyhledávání: '"lead-free solder"'
Autor:
Lu, Fuye1 (AUTHOR) fuyel@mail.dlut.edu.cn, Sun, Han1 (AUTHOR) 12405053@mail.dlut.edu.cn, Yang, Wenlong1 (AUTHOR) ywl@mail.dlut.edu.cn, Zhou, Tianshuo1 (AUTHOR) zhou22205039@mail.dlut.edu.cn, Wang, Yunpeng1 (AUTHOR) yunpengw@dlut.edu.cn, Ma, Haoran2 (AUTHOR) mhr@dlut.edu.cn, Ma, Haitao1 (AUTHOR) htma@dlut.edu.cn, Chen, Jun2 (AUTHOR) htma@dlut.edu.cn
Publikováno v:
Materials (1996-1944). Nov2024, Vol. 17 Issue 21, p5172. 11p.
Autor:
Shukla, Vishnu1 (AUTHOR) vishnu.raj.shukla@ucf.edu, Ahmed, Omar2 (AUTHOR), Su, Peng2 (AUTHOR), Jiang, Tengfei1 (AUTHOR) tengfei.jiang@ucf.edu
Publikováno v:
Materials (1996-1944). Jul2024, Vol. 17 Issue 14, p3602. 15p.
Autor:
Aiman A. Ramlee, Muhammad Amirul1, Said, Rita Mohd1 rita@unimap.edu.my, Mohamad Zaimi, Nur Syahirah1, Saud, Norainiza1
Publikováno v:
International Journal of Nanoelectronics & Materials. Jul2024, Vol. 17 Issue 3, p422-427. 6p.
EFFECT OF Ni-DEPOSITED CARBON NANOTUBES ON MORPHOLOGY AND SHEAR STRENGTH OF LEAD-FREE SOLDER JOINTS.
Publikováno v:
Journal of Physical Studies. 2024, Vol. 28 Issue 3, p3602-1-3602-6. 6p.
Autor:
State, Sabrina Patricia1,2,3 (AUTHOR) marius.enachescu@cssnt-upb.ro, Costovici, Stefania3 (AUTHOR) liana.anicai@cssnt-upb.ro, Enachescu, Marius3 (AUTHOR), Visan, Teodor3 (AUTHOR), Anicai, Liana3 (AUTHOR)
Publikováno v:
Materials (1996-1944). Mar2024, Vol. 17 Issue 5, p1034. 14p.
Autor:
Kamaruzzaman, Lina Syazwana1 (AUTHOR) linasyazwana@gmail.com, Goh, Yingxin1 (AUTHOR) gohyingxin@um.edu.my, Goh, Yi Chung1 (AUTHOR) gohchungchung@gmail.com
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 5, p285-295. 11p.
Autor:
Zhou, Jiacheng1 (AUTHOR) zhoujc1228@163.com, Shi, Jinglin2 (AUTHOR) shijinglin321@126.com, Xu, Lei2 (AUTHOR) xulei@composolder.com, Zhang, Fuwen2 (AUTHOR) zhangfuwen@aliyun.com, Wang, Zhigang2 (AUTHOR) wangzhigang@composolder.com, Hu, Qiang3 (AUTHOR) hqgrinm@163.com, He, Huijun3 (AUTHOR) hehj2000@vip.sina.com
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 5, p276-284. 9p.
Autor:
Liu, Fang1 (AUTHOR) liufang408@163.com, Wang, Zilong2 (AUTHOR) wangzhen@wtu.edu.cn, Zhou, JiaCheng2 (AUTHOR) zhoujiacheng0609@126.com, Wu, Yuqin2 (AUTHOR) yuqin_wu26@163.com, Wang, Zhen3 (AUTHOR) wangzhen@wtu.edu.cn
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 3, p174-184. 11p.
Publikováno v:
Productronic. 9/3/2024, p22-23. 2p.
Autor:
Yuan, Cadmus1 (AUTHOR) cayuan@fcu.edu.tw, Su, Qinghua2 (AUTHOR) 0967356474shq@gmail.com, Chiang, Kuo-Ning2,3 (AUTHOR) knchiang@pme.nthu.edu.tw
Publikováno v:
Materials (1996-1944). Jul2023, Vol. 16 Issue 14, p4922. 16p.