Zobrazeno 1 - 10
of 27 288
pro vyhledávání: '"lead-free solder"'
Autor:
Shangguan, Dongkai
This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practic
Autor:
Lu, Fuye1 (AUTHOR) fuyel@mail.dlut.edu.cn, Sun, Han1 (AUTHOR) 12405053@mail.dlut.edu.cn, Yang, Wenlong1 (AUTHOR) ywl@mail.dlut.edu.cn, Zhou, Tianshuo1 (AUTHOR) zhou22205039@mail.dlut.edu.cn, Wang, Yunpeng1 (AUTHOR) yunpengw@dlut.edu.cn, Ma, Haoran2 (AUTHOR) mhr@dlut.edu.cn, Ma, Haitao1 (AUTHOR) htma@dlut.edu.cn, Chen, Jun2 (AUTHOR) htma@dlut.edu.cn
Publikováno v:
Materials (1996-1944). Nov2024, Vol. 17 Issue 21, p5172. 11p.
EFFECT OF Ni-DEPOSITED CARBON NANOTUBES ON MORPHOLOGY AND SHEAR STRENGTH OF LEAD-FREE SOLDER JOINTS.
Publikováno v:
Journal of Physical Studies. 2024, Vol. 28 Issue 3, p3602-1-3602-6. 6p.
Autor:
State, Sabrina Patricia1,2,3 (AUTHOR) marius.enachescu@cssnt-upb.ro, Costovici, Stefania3 (AUTHOR) liana.anicai@cssnt-upb.ro, Enachescu, Marius3 (AUTHOR), Visan, Teodor3 (AUTHOR), Anicai, Liana3 (AUTHOR)
Publikováno v:
Materials (1996-1944). Mar2024, Vol. 17 Issue 5, p1034. 14p.
Autor:
ZAIMI, NUR SYAHIRAH MOHAMAD1, SALLEH, MOHD ARIF ANUAR MOHD1 arifanuar@unimap.edu.my, AL BAKRI ABDULLAH, MOHD MUSTAFA1, RAMLI, MOHD IZRUL IZWAN1
Publikováno v:
Archives of Metallurgy & Materials. 2023, Vol. 68 Issue 3, p981-986. 6p.
Autor:
Liu, Fang1 (AUTHOR) liufang408@163.com, Wang, Zilong2 (AUTHOR) wangzhen@wtu.edu.cn, Zhou, JiaCheng2 (AUTHOR) zhoujiacheng0609@126.com, Wu, Yuqin2 (AUTHOR) yuqin_wu26@163.com, Wang, Zhen3 (AUTHOR) wangzhen@wtu.edu.cn
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 3, p174-184. 11p.
Publikováno v:
Journal of Materials Research and Technology, Vol 32, Iss , Pp 1256-1267 (2024)
Minor alloying is an effective method to improve the performance of lead-free solder alloys. In this study, we propose a complementary Machine Learning (ML) strategy for minor alloying to design solder alloys with enhanced creep resistance. Two ML mo
Externí odkaz:
https://doaj.org/article/f3e4380ef7384262b70f0f48ae15a743
Autor:
Shalaby, Rizk Mostafa1 (AUTHOR) doctorrizk2@yahoo.co.uk, Saad, Mohamed2 (AUTHOR) mohyeldin@kku.edu.sa
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 2, p111-122. 12p.