Zobrazeno 1 - 10
of 83
pro vyhledávání: '"lead-free alloys"'
Akademický článek
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Publikováno v:
Archives of Foundry Engineering, Vol 17, Iss 3, Pp 111-116 (2017)
Lead-free alloys containing various amounts of zinc (4.5%, 9%, 13%) and constant copper addition (1%) were discussed. The results of microstructure examinations carried out by light microscopy (qualitative and quantitative) and by SEM were presented.
Externí odkaz:
https://doaj.org/article/9e07a7a407ff4e85970c94f5c5c081ba
Autor:
Clarissa Barros da Cruz, Rafael Kakitani, Marcella Gautê Cavalcante Xavierb, Bismarck Luiz Silva, Amauri Garcia, Noé Cheung, José Eduardo Spinelli
Publikováno v:
Materials Research, Vol 21, Iss suppl 1 (2018)
The present research work examines the microstructural arrangements formed during the transient solidification of eutectic Sn-0.2wt.%Ni and hypereutectic Sn-0.5wt.%Ni alloys. Also, it examines their respective correlations with solidification thermal
Externí odkaz:
https://doaj.org/article/eebcee193e3a44a5b96e57d0be2c196c
Publikováno v:
Mining and Metallurgy Engineering Bor, Vol 2014, Iss 2, Pp 117-122 (2014)
Although the European Union's directive about environment protection as WEEE and RoHS have been carried out in 2003, led solders are still in used in Serbia. In the aim to respect the European and world directives and laws, it is necessary to reduce
Externí odkaz:
https://doaj.org/article/11533c05cd9149b0b0db5eb13ab757ef
Akademický článek
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Publikováno v:
Materials Science-Poland, Vol 38, Iss 1, Pp 34-40 (2020)
This study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1853c23cceee62e5a1099409e92222b7
https://doi.org/10.2478/msp-2020-0025
https://doi.org/10.2478/msp-2020-0025
Publikováno v:
Radioengineering, Vol 21, Iss 2, Pp 573-579 (2012)
During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of intermetallic compounds (IMC) on rad
Externí odkaz:
https://doaj.org/article/1d119ae8e9674013bcaf048dfef853e4
Autor:
Mladenović Srba A., Marković Desimir D., Ivanić Ljubica S., Ivanov Svetlana Lj., Aćimović-Pavlović Zagorka S.
Publikováno v:
Hemijska Industrija, Vol 66, Iss 4, Pp 595-600 (2012)
Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have bee
Externí odkaz:
https://doaj.org/article/c528ad08518b4c89ad1a814247b16dad
Autor:
Klančnik G., Medved J.
Publikováno v:
Journal of Mining and Metallurgy. Section B: Metallurgy, Vol 47, Iss 2, Pp 179-192 (2011)
Al-Sb-Zn ternary system was investigated in the three phase region Al-AlSb-Zn, using differential thermal analysis (DTA), differential scanning calorimetry (DSC) and scanning electron microscope equipped with energy dispersive spectrometer (SEM-EDS).
Externí odkaz:
https://doaj.org/article/ceeb8fb9eba543c995aba91346417a54
Publikováno v:
Archives of Foundry Engineering, Vol 17, Iss 3, Pp 111-116 (2017)
Lead-free alloys containing various amounts of zinc (4.5%, 9%, 13%) and constant copper addition (1%) were discussed. The results of microstructure examinations carried out by light microscopy (qualitative and quantitative) and by SEM were presented.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e536a473801c4bb3c28a1bdc426bb84e
https://doi.org/10.1515/afe-2017-0101
https://doi.org/10.1515/afe-2017-0101