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Publikováno v:
Metrology and Measurement Systems, Vol 22, Iss 4, Pp 531-546 (2015)
Accurate flatness measurement of silicon wafers is affected greatly by the gravity-induced deflection (GID) of the wafers, especially for large and thin wafers. The three-point-support method is a preferred method for the measurement, in which the GI
Externí odkaz:
https://doaj.org/article/16beacea1ec1496f9192ec7407457b55
Publikováno v:
Metrology and Measurement Systems, Vol 22, Iss 4, Pp 531-546 (2015)
Accurate flatness measurement of silicon wafers is affected greatly by thegravity-induced deflection(GID) of the wafers, especially for large and thin wafers. The three-point-support method is a preferred method for the measurement, in which the GID
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