A review of the research and advances in electromagnetic joining of fiber‐reinforced thermoplastic composites

Autor: Kishore Debnath, Mridusmita Roy Choudhury

Publikováno v: Polymer Engineering & Science. 59:1965-1985

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ccd74691c001ca368de83fe4cbc51275
https://doi.org/10.1002/pen.25207

A Numerical Analysis of the Temporal and Spatial Temperature Development during the Ultrasonic Spot Welding of Fibre-Reinforced Thermoplastics

Autor: Shahan Tutunjian, Martin Dannemann, Niels Modler, Michael Kucher, Albert Fellermayer

Publikováno v: Journal of Manufacturing and Materials Processing, Vol 4, Iss 2, p 30 (2020)

The ultrasonic spot welding of fibre-reinforced thermoplastic laminates has received great interest from researchers, mainly in the fields of aerospace and automotive industries. It offers an efficient solution to join large thermoplastic composite p

Externí odkaz: https://doaj.org/article/afae986fa5ca4bd6b7bd53cd89769e63

A Numerical Analysis of the Temporal and Spatial Temperature Development during the Ultrasonic Spot Welding of Fibre-Reinforced Thermoplastics

Autor: Niels Modler, Michael Kucher, Shahan Tutunjian, Albert Fellermayer, Martin Dannemann

Publikováno v: Journal of Manufacturing and Materials Processing, Vol 4, Iss 30, p 30 (2020)
Journal of Manufacturing and Materials Processing
Volume 4
Issue 2

The ultrasonic spot welding of fibre-reinforced thermoplastic laminates has received great interest from researchers, mainly in the fields of aerospace and automotive industries. It offers an efficient solution to join large thermoplastic composite p

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::39defd4d7b7c4317cfc6195ac37edab1
https://www.mdpi.com/2504-4494/4/2/30

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A Comparative Study of Microwave Welding Using Multiwalled Carbon Nanotubes and Silicon Carbide Nanowhiskers as Microwave Susceptors.

Autor: Phey Yee Foong¹, Chun Hong Voon¹ chvoon@unimap.edu.my, Bee Ying Lim², Pei Leng Teh², Keat Yeoh, Cheow², Rojan, Mohd Afendi³, Parmin, Nor Azizah³, Gopinath, Subash C. B.^1,2, Foo Wah Low⁴, Kashif, Muhammad⁵, Abdul Rahman, Nor Azura², Sun Ting Sam², Perumal, Veeradasan^6,7

Publikováno v: International Journal of Nanoelectronics & Materials. Oct2024, Vol. 17 Issue 4, p535-540. 6p.