Zobrazeno 1 - 10
of 185
pro vyhledávání: '"interconnect modeling"'
Publikováno v:
IEEE Access, Vol 9, Pp 39028-39042 (2021)
This work presents a novel approach for the accurate estimation of multiple time-delays from the frequency response of a distributed system. The proposed approach is based on a powerful and flexible machine learning technique, namely, the least-squar
Externí odkaz:
https://doaj.org/article/c1ec7ad4cfa74a349dcafac4490a88fa
Akademický článek
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Akademický článek
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Autor:
Dries Bosman, Martijn Huynen, Daniel De Zutter, Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne, Dries Vande Ginste
Publikováno v:
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
In state-of-the-art interconnect design, topologies including magnetic materials, such as the so-called superlattice conductors, are rapidly emerging as a novel strategy to handle the challenges associated with the evolution toward higher operating f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a0138ce095afb4c92cc815543d98364
https://hdl.handle.net/1854/LU-01GWH3AMZVDW5A6BB6BSWYCXVJ
https://hdl.handle.net/1854/LU-01GWH3AMZVDW5A6BB6BSWYCXVJ
Akademický článek
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Autor:
Bosman, Dries, Huynen, Martijn, De Zutter, Daniël, Sun, Xiao, Pantano, Nicolas, Van der Plas, Geert, Beyne, Eric, Vande Ginste, Dries
Publikováno v:
2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022)
In this contribution, we propose a novel approach to rigorously model interconnect structures with an arbitrary convex polygonal cross-section and general, piecewise homogeneous, material parameters. A full-wave boundary integral equation formulation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2fd3c4a9bbe14b68458409b3f683e81f
https://doi.org/10.1109/epeps53828.2022.9947108
https://doi.org/10.1109/epeps53828.2022.9947108
Autor:
Kamil Yavuz Kapusuz, Eric Beyne, Martijn Huynen, Xiao Sun, Dries Vande Ginste, D. De Zutter, Geert Van der Plas
Publikováno v:
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
This article presents a full-wave method to characterize lossy conductors in an interconnect setting. To this end, a novel and accurate differential surface admittance operator for cuboids based on entire domain basis functions is formulated. By comb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b8cd2439bf657acf05d6ed1ea730016c
https://doi.org/10.1109/tmtt.2019.2957485
https://doi.org/10.1109/tmtt.2019.2957485
Autor:
Yi, Yang
Interconnect modeling plays an important role in design and verification of VLSI circuits and packages. For low frequency circuits, great advances for parasitic resistance and capacitance extraction have been achieved and wide varieties of techniques
Externí odkaz:
http://hdl.handle.net/1969.1/ETD-TAMU-2009-12-2912
Autor:
Kumar, Vachan
Modeling approaches are developed to optimize emerging on-chip and off-chip electrical interconnect technologies and benchmark them against conventional technologies. While transistor scaling results in an improvement in power and performance, interc
Externí odkaz:
http://hdl.handle.net/1853/54280