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SiN-based platform toward monolithic integration in photonics and electronics

Autor: Henry H. Radamson, Guilei Wang, Junfeng Li, Wenjuan Xiong, Chao Zhao, Wenwu Wang

Publikováno v: Journal of Materials Science: Materials in Electronics. 32:1-18

This work presents a review of silicon nitride applications in Si photonics and electronics. As the one of the prominent photonics platform, it owes excellent characteristics in optical communication that is complimentary in performance to the silico

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b0fb4bd55d653a1ae6f1d5b6ae00c979
https://doi.org/10.1007/s10854-020-04909-z

1.3 Integration of photonics and electronics

Autor: Jos J. G. M. van der Tol, MK Meint Smit, Kevin A. Williams

Publikováno v: ISSCC
2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, 29-34
STARTPAGE=29;ENDPAGE=34;TITLE=2019 IEEE International Solid-State Circuits Conference, ISSCC 2019

The market for photonic integrated circuits (PICs) is rapidly growing. Photonic integration which is now the dominant technology in high-bandwidth and long-distance telecommunications is increasingly applied to shorter distances within data centers.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::37c41db8277b108c38385f6cc401a8ad
http://www.scopus.com/inward/record.url?scp=85063536452&partnerID=8YFLogxK

Wafer scale Integration of Photonics and Electronics

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dris___00893::0f9b253d0025a7ee2d2981628c7fe76b