Zobrazeno 1 - 10
of 662
pro vyhledávání: '"immersion cooling"'
Autor:
Suresh, Pratheek, Chakravarthy, Balaji
Publikováno v:
International Journal of Numerical Methods for Heat & Fluid Flow, 2024, Vol. 34, Issue 8, pp. 2917-2942.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/HFF-08-2023-0468
Autor:
Xi Cao, Qianlei Shi, Qian Liu, Mingyi Liu, Chuanliang Xiong, Bailian Peng, Chuanzhao Cao, Xianfa Wang, Yizhao Chen, Qian Cheng, Wei Liu, Chengjun Wen, Chaoran Yang, Xing Ju
Publikováno v:
Case Studies in Thermal Engineering, Vol 63, Iss , Pp 105377- (2024)
The battery thermal management system (BTMS) is a necessary consideration to ensure the efficiency, safety, and reliability of battery energy storage systems (BESS). Immersion cooling, with its high heat transfer efficiency and uniform heat distribut
Externí odkaz:
https://doaj.org/article/3fd970c1a7564b608194c8d32fccd425
Publikováno v:
Case Studies in Thermal Engineering, Vol 63, Iss , Pp 105386- (2024)
High efficiency cooling method in data center (DC), such as single-phase immersion cooling system, has received more attention. For practical application, serval servers would be placed in a liquid cooling tank where the coolant should be evenly tran
Externí odkaz:
https://doaj.org/article/4d27580d3a924e0991e831c5d2c03aaf
Autor:
Chaoran Yang, Qian Liu, Mingyi Liu, Qianlei Shi, Xi Cao, Jie Pei, Chuanzhao Cao, Haodong Lei, Xiaofan Ping, Xing Ju
Publikováno v:
Case Studies in Thermal Engineering, Vol 61, Iss , Pp 104922- (2024)
The widespread use of high-capacity LiFePO4 batteries (LFPB) is crucial for meeting the growing demand for energy storage systems (ESSs). This requires effective thermal management systems, and single-phase immersion cooling (SPIC) is emerging as a p
Externí odkaz:
https://doaj.org/article/5cfa53a497234f61a473836be5ed0142
Publikováno v:
IEEE Open Journal of Power Electronics, Vol 5, Pp 1107-1118 (2024)
This paper explores two-phase immersion cooling using sealed enclosures of dielectric fluid as a technique to achieve compact, power dense converters on a single printed circuit board (PCB). The proposed approach employs passive circulation of the fl
Externí odkaz:
https://doaj.org/article/914d3341ce52477eb07de2a66a34d03a
Autor:
S. M. Imrat Rahman, Ali Moghassemi, Ali Arsalan, Laxman Timilsina, Phani Kumar Chamarthi, Behnaz Papari, Gokhan Ozkan, Christopher S. Edrington
Publikováno v:
IEEE Access, Vol 12, Pp 50633-50672 (2024)
Recently, the thermal management of power electronic converters has gained significant attention due to the continuous trend of developing very compact power electronic converters with high power density. With the evolution of power semiconductor dev
Externí odkaz:
https://doaj.org/article/63dd445d46254027b51ab47402936ca6
Publikováno v:
Batteries, Vol 10, Iss 8, p 285 (2024)
This study aims to assess the compatibility of various e-thermal fluids for immersion cooling in battery electric vehicles through a copper wire resistance corrosion test. The tested fluids include a polyalphaolefin, diester, mineral oil API G-III, t
Externí odkaz:
https://doaj.org/article/730f71c949c544dfa425e332bb1ede36
Publikováno v:
Energies, Vol 17, Iss 15, p 3615 (2024)
The cooling of server components has been developed over the past few years in order to meet increasing cooling requirements. The growth in performance and power density increases the cooling demand. To gain a better understanding of the evolution an
Externí odkaz:
https://doaj.org/article/4dfb9eb6511b49b9ba80400a8996c976
Publikováno v:
Energy Informatics, Vol 6, Iss 1, Pp 1-18 (2023)
Abstract Air cooling is the traditional solution to chill servers in data centers. However, the continuous increase in global data center energy consumption combined with the increase of the racks’ power dissipation calls for the use of more effici
Externí odkaz:
https://doaj.org/article/a598d82529ea43da96a3cdb1efee61eb
Publikováno v:
Engineering, Vol 26, Iss , Pp 185-197 (2023)
The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a
Externí odkaz:
https://doaj.org/article/6a7103d330984b27b40bad3f56127b61