Zobrazeno 1 - 1
of 1
pro vyhledávání: '"form birefringence breaking"'
Autor:
Jiamin Liu, Jinlong Zhu, Zhe Yu, Xianrui Feng, Zedi Li, Lei Zhong, Jinsong Zhang, Honggang Gu, Xiuguo Chen, Hao Jiang, Shiyuan Liu
Publikováno v:
International Journal of Extreme Manufacturing, Vol 7, Iss 1, p 015601 (2024)
In integrated circuit (IC) manufacturing, fast, nondestructive, and precise detection of defects in patterned wafers, realized by bright-field microscopy, is one of the critical factors for ensuring the final performance and yields of chips. With the
Externí odkaz:
https://doaj.org/article/e665f2004f634ebd80fc25d4220811ac
