Zobrazeno 1 - 2
of 2
pro vyhledávání: '"encapsulation for electronic"'
Autor:
Rudy, Veronika
The thesis deals with the pouring of epoxy materials over LED strips. The research part contains an introduction to photometry and summarizes the types of potting compounds along with their characteristics. The practical part delves into the effect d
Externí odkaz:
http://www.nusl.cz/ntk/nusl-443229
Autor:
Gupta, Satyajit
The ultra high barrier films for packaging find applications in a wide variety of areas where moisture and oxygen barrier is required for improved shelf-life of food/beverage products and for microbial free pharmaceutical containers. These materials
Externí odkaz:
http://etd.iisc.ernet.in/2005/3408
http://etd.iisc.ernet.in/abstracts/4275/G25906-Abs.pdf
http://etd.iisc.ernet.in/abstracts/4275/G25906-Abs.pdf