Zobrazeno 1 - 10
of 1 407
pro vyhledávání: '"electronics packaging"'
Autor:
Xinyue Wang, Haixue Chen, Zhoudong Yang, Wenting Liu, Zejun Zeng, Guoqi Zhang, Jing Zhang, Jiajie Fan, Pan Liu
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 8433-8450 (2024)
With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the vi
Externí odkaz:
https://doaj.org/article/e6419d670a754c9483e041c6df423f3e
Publikováno v:
IEEE Access, Vol 12, Pp 17782-17792 (2024)
Thermal Interface Materials (TIMs) are widely used in electronic packaging. Increasing power density and limited assembly space pose high demands on thermal management. Large cooling surfaces need to be covered efficiently. When joining the heatsink,
Externí odkaz:
https://doaj.org/article/864cb2c9f5b2453abf27b1dbffc89d08
Autor:
Baïri, Abderrahmane1 (AUTHOR) abairi@u-paris10.fr, Haddad, Oriana1 (AUTHOR), Guinart, Jean-Pascal1 (AUTHOR), Adeyeye, Kemi2 (AUTHOR), Alilat, Nacim1 (AUTHOR)
Publikováno v:
Heat Transfer Engineering. 2018, Vol. 39 Issue 4, p353-358. 6p. 1 Diagram, 4 Graphs.
Publikováno v:
Materials, Vol 17, Iss 17, p 4372 (2024)
Sn–Bi-based, low-temperature solder alloys are being developed to offer the electronics manufacturing industry a path to lower temperature processes. A critical challenge is the significant microstructural and lattice parameter changes that these a
Externí odkaz:
https://doaj.org/article/7a2a01e71f70405b908e288a8529d0ca
Autor:
SIIL SUNG
Publikováno v:
ICIC Express Letters, Part B: Applications; Jun2024, Vol. 15 Issue 6, p611-617, 7p
Autor:
Heimsch, Rich1
Publikováno v:
SMT: Surface Mount Technology. Jun2017, Vol. 32 Issue 6, p42-45. 3p. 1 Color Photograph.
Publikováno v:
IEEE Transactions on Power Electronics. Oct2018, Vol. 33 Issue 10, p8553-8564. 12p.
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. May2018, Vol. 8 Issue 5, p773-783. 11p.
Autor:
Goettel, Benjamin1, Winkler, Wolfgang2, Bhutani, Akanksha1, Boes, Florian1, Pauli, Mario1, Zwick, Thomas1
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. Jan2018, Vol. 8 Issue 1, p73-81. 9p.
Autor:
Hong Li, Hongyang Li, Bo Sheng, Bing Zheng, Sujun Shi, Qing Cai, Wenqi Xu, Xiuchen Zhao, Ying Liu
Publikováno v:
Materials, Vol 17, Iss 1, p 200 (2023)
As the integration technology for integrated circuit (IC) packaging continues to advance, the issue of electromagnetic interference in IC packaging becomes increasingly prominent. Magnetic materials, acknowledged for their superior electromagnetic ab
Externí odkaz:
https://doaj.org/article/96c0455fe8d14ac4a61c45a3ba394973