Zobrazeno 1 - 10
of 1 644
pro vyhledávání: '"electronic cooling"'
Publikováno v:
Propulsion and Power Research, Vol 13, Iss 2, Pp 194-206 (2024)
Mini-channel heatsinks are one of the most effective thermal management methods for high heat flux devices due to the high performance of convective heat transfer. In recent years, various techniques have been innovated to improve the thermal profici
Externí odkaz:
https://doaj.org/article/e042262771364e5aa957a0dfb295ab9e
Autor:
Bairi Levi Rakshith, Lazarus Godson Asirvatham, Appadurai Anitha Angeline, Bryan Lancy, J Perinba Selvin Raj, Jefferson Raja Bose, Somchai Wongwises
Publikováno v:
Energy Conversion and Management: X, Vol 24, Iss , Pp 100717- (2024)
Flat heat pipes (FHPs) with rectangular groove wick structures fail to sufficiently uplift the working fluid’s liquid meniscus to cover the upper sides of the groove walls due to the vertically flat wall design. This results in the formation of non
Externí odkaz:
https://doaj.org/article/726de2c428384f8f84ddbcaee4755e24
Autor:
Jaya Antony Perinba Selvin Raj, Lazarus Godson Asirvatham, Appadurai Anitha Angeline, Bairi Levi Rakshith, Stephen Manova, Jefferson Raja Bose, Somchai Wongwises
Publikováno v:
Results in Engineering, Vol 24, Iss , Pp 102917- (2024)
Multiport mini-channel thermosyphon with hydraulic diameters less than 2 mm undergoes a severe entrainment problem both in vapor and liquid regions, impeding the flow and affecting the performance characteristics. To address this issue, a novel multi
Externí odkaz:
https://doaj.org/article/e4e3094873de441694dafffebbbf2100
Publikováno v:
World Journal of Engineering, 2022, Vol. 21, Issue 1, pp. 107-114.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/WJE-01-2022-0018
Publikováno v:
Tehnički Vjesnik, Vol 31, Iss 6, Pp 2003-2013 (2024)
Metal foam heat sinks are preferred in electronic cooling systems with their advantages such as superior properties in heat transfer, light weight and ability to mix the cooling fluid. It is very difficult to conduct extensive experimental studies wi
Externí odkaz:
https://doaj.org/article/fa822032676d46b786182bf119f75813
Publikováno v:
International Journal of Numerical Methods for Heat & Fluid Flow, 2023, Vol. 33, Issue 8, pp. 2902-2926.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/HFF-02-2023-0053
Publikováno v:
Engineering, Vol 26, Iss , Pp 185-197 (2023)
The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a
Externí odkaz:
https://doaj.org/article/6a7103d330984b27b40bad3f56127b61
Autor:
Yousef Alihosseini, Yaser Oghabneshin, Amir Rezazad Bari, Sahel Moslemi, Mohammad Zabetian Targhi, Wei Guo, Amirarsalan Mashhadian
Publikováno v:
Case Studies in Thermal Engineering, Vol 53, Iss , Pp 103888- (2024)
Recently, the advantages of microchannel and micro pin-fin heat sinks for cooling have become clear. This study delves into the effects of hybrid designs on electronic chip cooling by combining microchannel and pin-fin patterns. The research contrast
Externí odkaz:
https://doaj.org/article/dced58eaa51c4f7c823fbd002d96e1c2
Publikováno v:
International Journal of Numerical Methods for Heat & Fluid Flow, 2023, Vol. 33, Issue 7, pp. 2478-2508.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/HFF-10-2022-0608
Publikováno v:
Micromachines, Vol 15, Iss 4, p 429 (2024)
This paper describes the procedure of design and manufacture of a micro-ejector proposed for miniature ejection refrigeration systems. It describes the procedure of design, fabrication, and experimentation on supersonic micro-ejectors and makes the c
Externí odkaz:
https://doaj.org/article/b3f6006609ab495c93e69336d8800b52