Zobrazeno 1 - 1
of 1
pro vyhledávání: '"dotted-I interconnect trees"'
Electromigration tests on different Cu dual-damascene interconnect tree structures consisting of various numbers of straight via-to-via lines connected at the common middle terminal have been carried out. Like Al-based interconnects, the reliability
Externí odkaz:
http://hdl.handle.net/1721.1/3730
