Aerosol Jet and Inkjet Printing Methods for Die-Level Packaging of Custom MEMS Devices

Autor: Sherehiy, Andriy, Jackson, Douglas, Sassa, Michael, Sills, Daniel, Ratnayake, Dilan, Zhang, Ruoshi, Zhang, Ruoshi, Yang, Zhong, Walsh, Kevin, Naber, John, Popa, Dan

Publikováno v: Journal of Micro and Nano Science and Engineering; 20240101, Issue: Preprints p1-37, 37p

3D die level packaging for hybrid systems

Autor: N. P. Vamsi Krishna, Prosenjit Sen

Publikováno v: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

The aim of this work is to develop and optimize processing technologies required for 3-D die level packaging of hybrid systems including MEMS and MOS components. In this paper we report the process development for stacking of ultra-thin silicon dies

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7d0973dd5978c7ceee1c8fd9e802f687
https://doi.org/10.1109/iitc-amc.2016.7507703

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Autor: Xin Chang, Leung Tsang

Publikováno v: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Most of the via modeling methods assumed that only the TEM mode which is the fundamental mode can propagate due to the thickness of substrate being electrically small, and all the higher order waveguide modes and anisotropic modes decay rapidly along

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1a69c85564c20d4482d2979a25c3786a
https://doi.org/10.1109/ectc.2014.6897608

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Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics

Autor: Julie Widiez, Bastien Letowski, Pierre Perreau, Jean-Christophe Crebier, Perceval Coudrain, Kremena Vladimirova, Gregory Enyedi, Nicolas Rouger

Publikováno v: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, France. pp.1251-1257, ⟨10.1109/ECTC.2018.00193⟩

International audience; This paper presents a wafer-level pre-packagingtechnology for power devices. The concept consists in theimplementation of a thick 3D patterned copper leadframeensuring the interconnections of the power devices amongthem or wit

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::02f98f81ae7cfcdd1209324739ad54c4
https://cea.hal.science/cea-02185324