Zobrazeno 1 - 5
of 5
pro vyhledávání: '"de Campos KA"'
Autor:
Hein LR; LAIMat - Materials Imaging Laboratory, Materials and Technology Department, Faculty of Engineering at Guaratinguetá, UNESP - São Paulo State University, Guaratinguetá, SP, Brazil., de Oliveira JA, de Campos KA
Publikováno v:
Microscopy research and technique [Microsc Res Tech] 2013 Sep; Vol. 76 (9), pp. 909-13. Date of Electronic Publication: 2013 Jun 29.
Autor:
Hein LR; UNESP-Univ Estadual Paulista, DMT-Department of Materials and Technology, LAIMat-Materials Imaging Laboratory, Av. Ariberto Pereira da Cunha, 333, Guaratinguetá, SP, 12.516-410, Brazil. rhein@feg.unesp.br, de Oliveira JA, de Campos KA
Publikováno v:
Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada [Microsc Microanal] 2013 Apr; Vol. 19 (2), pp. 496-500. Date of Electronic Publication: 2013 Feb 12.
Autor:
Hein LR; LAIMat-Materials Image Analysis Laboratory, DMT-Department of Materials and Technology, UNESP-Universidade Estadual Paulista, Guaratinguetá, São Paulo, Brazil. rhein@feg.unesp.br, De Oliveira JA, De Campos KA, Caltabiano PC
Publikováno v:
Microscopy research and technique [Microsc Res Tech] 2012 Nov; Vol. 75 (11), pp. 1593-607. Date of Electronic Publication: 2012 Jul 18.
Autor:
Hein LR; UNESP - Univ Estadual Paulista, DMT - Department of Materials and Technology, LAIMat - Materials Image Analysis Laboratory, Av. Ariberto Pereira da Cunha, 333, Guaratinguetá, SP 12.516-410, Brazil. rhein@feg.unesp.br, de Campos KA, Caltabiano PC
Publikováno v:
Micron (Oxford, England : 1993) [Micron] 2012 Oct; Vol. 43 (10), pp. 1039-49. Date of Electronic Publication: 2012 May 02.
Autor:
De Oliveira Caltabiano PC; DMT, Department of Materials and Technology, UNESP, Univ Estadual Paulista, LAIMat, Materials Image Analysis Laboratory, Av. Ariberto Pereira da Cunha 333, Guaratinguetá, SP 12.516-410, Brazil., Rosa PH, De Campos KA, De Oliveira Hein LR
Publikováno v:
Microscopy research and technique [Microsc Res Tech] 2012 Sep; Vol. 75 (9), pp. 1155-8. Date of Electronic Publication: 2012 Mar 21.