Zobrazeno 1 - 5
of 5
pro vyhledávání: '"circuits céramiques"'
Publikováno v:
Scopus-Elsevier
This paper presents the design and thermal characterization of a 15 × 22 mm2 LTCC module dedicated to the packaging of the elements of a miniature atomic clock. This module acts as a carrier for the components of the clock as well as temperature con
Publikováno v:
Scopus-Elsevier
The continuing trend in the automotive and aviation industries to reduce complexity of electronic systems by removing cooling results in a need for high temperature electronics and associated packaging technologies. To ensure reliability over long pe
Publikováno v:
Solid State Phenomena
Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the deg
Publikováno v:
Sensors and Actuators A: Physical
In this work, we study the long-term mechanical strength under static load - i.e. static fatigue performance or resistance to subcritical crack growth - of ceramic thick-film circuits, namely how the static fatigue of the substrate is affected by the
This paper presents the development of radial eddy-current position sensors for high temperature active magnetic bearing (AMB) applications. Thick-film technology was used to realize silver coils printed on ceramic substrates. Long term measurements
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______185::d03b61dc78eebccf710f092271bd49dc
https://infoscience.epfl.ch/record/97607
https://infoscience.epfl.ch/record/97607