Zobrazeno 1 - 10
of 3 591
pro vyhledávání: '"circuit reliability"'
Publikováno v:
Electronics Letters, Vol 60, Iss 23, Pp n/a-n/a (2024)
Abstract In this paper, a radiation hardened by design StrongARM comparator is proposed to mitigate the radiation effects. With 12 additional transistors compared to the conventional one, the proposed structure shows much higher immunity to single‐
Externí odkaz:
https://doaj.org/article/faee7d84b90640c39899e1ae1fd7e1ae
Autor:
Jadczak, Kamila1, Białek, Rafał1
Publikováno v:
Journal of Konbin. Mar2018, Vol. 45 Issue 1, p165-174. 10p.
Publikováno v:
Yuanzineng kexue jishu, Vol 57, Iss 12, Pp 2326-2336 (2023)
With the development of semiconductor technology, the size of transistors continues to shrink. In complex radiation environments in aerospace and other fields, small-sized circuits are more prone to soft error (SE). Currently, single-node upset (SNU)
Externí odkaz:
https://doaj.org/article/b2be9a420ce346f1933c29f746615ec6
Akademický článek
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Autor:
Jun-Cheol Jeon
Publikováno v:
Nanomaterials, Vol 14, Iss 17, p 1460 (2024)
As the relationship between energy and information loss and reversible gates was revealed, much interest in reversible gate design arose, and as quantum-dot cellular automata (QCA) gained attention as a next-generation nano circuit design technology,
Externí odkaz:
https://doaj.org/article/2c78c43e4da04e24ab40a44763792e71
Publikováno v:
Journal of Electrical & Computer Engineering Innovations (JECEI); Winter/Spring2024, Vol. 12 Issue 1, p235-246, 12p
Autor:
Nima Jafarzadeh, Ahmad Jalili, Jafar A. Alzubi, Khosro Rezaee, Yang Liu, Mehdi Gheisari, Bahram Sadeghi Bigham, Amir Javadpour
Publikováno v:
IET Circuits, Devices and Systems, Vol 17, Iss 4, Pp 250-257 (2023)
Abstract Network‐on‐Chip (NoC) is a key component in chip multiprocessors (CMPs) as it supports communication between many cores. NoC is a network‐based communication subsystem on an integrated circuit, most typically between modules in a syste
Externí odkaz:
https://doaj.org/article/95fa5902782b4ed5a31f4e2bd55413ff
Autor:
Woychik, Charles G.1 CWOYCHIK@invensas.com, Lee, Sangil1, McGrath, Scott1, Arkalgud, Sitaram1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2015 4th Quarter, Vol. 12 Issue 4, p219-225. 7p.
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 11, Pp 179-189 (2023)
The integration density of electronic systems is limited by the reliability of the integrated circuits. To guarantee the overall performance, the integrated circuit reliability must be modeled and analyzed at the early design stage. This paper review
Externí odkaz:
https://doaj.org/article/76ff7c673f024195b26807e202ddedf7
Publikováno v:
Journal of Applied Physics. Aug2013, Vol. 114 Issue 8, p084103. 11p. 2 Black and White Photographs, 5 Charts, 9 Graphs.