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pro vyhledávání: '"cheng-siang jhang"'
Image Based Automatic Defect Inspection of Substrate, Die Attach and Wire Bond in IC Package Process
Autor:
Cheng-Siang Jhang, 張程翔
106
With the development of global technology, all modern electronic products are operated through these integrated circuits (ICs). Personal computers, smart phones, and televisions are rely on it to execute various key procedures. In the future
With the development of global technology, all modern electronic products are operated through these integrated circuits (ICs). Personal computers, smart phones, and televisions are rely on it to execute various key procedures. In the future
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/29j252
Autor:
cheng-siang jhang, 張程翔
95
The lateral earth pressure distributions assumed in the current handbooks or guidelines for designing Mechanically Stabilized Earth Wall for evaluating internal stability are not exactly the same. In order to figure out the actual lateral ear
The lateral earth pressure distributions assumed in the current handbooks or guidelines for designing Mechanically Stabilized Earth Wall for evaluating internal stability are not exactly the same. In order to figure out the actual lateral ear
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/25114197082610000132