Zobrazeno 1 - 10
of 107
pro vyhledávání: '"ceramic packaging"'
Publikováno v:
IET Microwaves, Antennas & Propagation, Vol 18, Iss 4, Pp 188-195 (2024)
Abstract This article presents a millimetre‐wave (MMW) wideband multibeam antenna array with a pillbox transition using multilayer low‐temperature cofired ceramic (LTCC) technology. The mushroom structure with dual resonant modes offers wideband
Externí odkaz:
https://doaj.org/article/b4c30faf36984a60bf4972ed2fb6f456
Autor:
Hoang Linh Bach1 linh.bach@iisb.fraunhofer.de, Dirksen, Daniel1, Blechinger, Christoph1, Endres, Tobias Maximilian1, Bayer, Christoph Friedrich1, Schletz, Andreas1, März, Martin1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. Oct2019, Vol. 16 Issue 4, p176-181. 6p.
Autor:
Liangyu Chen1 liangyu.chen-1@nasa.gov, Neudeck, Philip G.2, Meredith, Roger D.2, Lukco, Dorothy3, Spry, David J.2, Nakley, Leah M.2, Phillips, Kyle G.4, Beheim, Glenn M.2, Hunter, Gary W.2
Publikováno v:
Journal of Microelectronic & Electronic Packaging. Apr2019, Vol. 16 Issue 2, p78-83. 6p.
Autor:
Liang-Yu Chen1 Liangyu.chen-1@nasa.gov, Neudeck, Philip G.2, Spry, David J.2, Beheim, Glenn M.2, Hunter, Gary W.2
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2017 1st Quarter, Vol. 14 Issue 1, p11-16. 6p.
Autor:
Guo, Jing1, Baker, Amanda L.1, Guo, Hanzheng1, Lanagan, Michael1, Randall, Clive A.1 car4@psu.edu
Publikováno v:
Journal of the American Ceramic Society. Feb2017, Vol. 100 Issue 2, p669-677. 9p.
Autor:
Tang Hongyan, Lu Yang
Publikováno v:
Applied Mathematics and Nonlinear Sciences, Vol 8, Iss 2, Pp 1029-1040 (2023)
Ceramic packaging design is the crystallisation of industrial design, ceramic art design and graphic design. Rhino software is used to design ceramic bottles to express the designer’s ideas accurately. Rhino is well suited to a market where new pro
Externí odkaz:
https://doaj.org/article/de5aef4f94b94d2f94b72ba82972f09f
Autor:
Burkhardt, T.1,2 Thomas.Burkhardt@iof.fraunhofer.de, Hornaff, M.1, Acker, A.1, Peschel, T.1, Beckert, E.1, Suphan, K.-H.3, Mensel, K.4, Jirak, S.4, Eberhardt, R.1, Tünnermann, A.1,2
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2012 3rd Quarter, Vol. 9 Issue 3, p113-119. 7p.
Publikováno v:
IET Circuits, Devices and Systems, Vol 15, Iss 6, Pp 504-510 (2021)
Abstract A new method to design transformer‐free low pass (LP) ladder network with improved stop‐band suppression performance is introduced. The parametric representation of back‐end impedance of LP filter network is established with minimum im
Externí odkaz:
https://doaj.org/article/22bd160a0e2a4852a46d05833a670f91
Autor:
Tripathi, Shivendra1, Patel, Hitesh M.1, Patil, Shrikant A.1, Pandey, Deep Kumar1, Prajapati, Ishwar Lal1, Joshi, Chandresh N.1, Sharma, Rakesh S.1, Arora, Rajkumar1
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. Feb2015, Vol. 5 Issue 2, p279-286. 8p.
Publikováno v:
Materials Research Express, Vol 10, Iss 9, p 096515 (2023)
High-reliable ceramic packages are impressionable to the parallel seam welding (PSW) parameters leading to low yield and reliability. In this study, the structure of the ceramic package was modified by changing the sealing ring to improve weldability
Externí odkaz:
https://doaj.org/article/9c17673c24d04220adc0b9e94ac26547