Zobrazeno 1 - 5
of 5
pro vyhledávání: '"ceramic modules"'
Publikováno v:
Scopus-Elsevier
Current low temperature electronics (175°C) for prolonged periods of time require packaging technologies that have to tackle many new problems. At high temperatures traditionally used materials such as organic circuit boards, adhesives and standard
Publikováno v:
Sadhana. 34:677-687
Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, e
Autor:
Y. Petremand, Thomas Maeder, Florian Gruet, Fabrizio Vecchio, Christoph Affolderbach, Gaetano Mileti, Nicolaas F. de Rooij
Publikováno v:
Optics and Lasers in Engineering
We present a compact frequency-stabilized laser system locked to the Rubidium absorption line of a micro-fabricated reference cell. A printed circuit board (PCB) is used to carry all the components and part of the electronics, and low-temperature co-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c0e0604ac49cc38e7ddf599155d8a7ee
https://infoscience.epfl.ch/record/186048
https://infoscience.epfl.ch/record/186048
3D structuration of LTCC and related technologies for thermal management and microfluidic structures
Publikováno v:
Scopus-Elsevier
Ceramic technologies such as LTCC (Low Temperature Co-fired Ceramic) and thick-film are used widely in electronic circuits exposed to harsh environments, for applications in fields such as aerospace, automotive and energy exploration, where, owing to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::f150d10b4825658146e90edd6612eccb
https://infoscience.epfl.ch/record/183829
https://infoscience.epfl.ch/record/183829