Zobrazeno 1 - 1
of 1
pro vyhledávání: '"analyse des compromis"'
Autor:
Băjenescu, Titu-Marius I.
Publikováno v:
Journal of Engineering Science (Chişinău), Vol XXVII, Iss 1, Pp 28-35 (2020)
A major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also, reliability concerns will be extremely important: elec
Externí odkaz:
https://doaj.org/article/71ffa4a9b7e149aab6287d0b3a809c09
