Zobrazeno 1 - 10
of 105
pro vyhledávání: '"alloy bonding"'
Autor:
Sk. Ainul Bari, Sumedha Moharana
Publikováno v:
Journal of Asian Architecture and Building Engineering, Vol 23, Iss 3, Pp 898-920 (2024)
Structural health monitoring aided with the electromechanical impedance technique (EMI) is gaining popularity among researchers due to its dual sensing application and noise-free sensor results, and it is very sensitive to inceptive structural altern
Externí odkaz:
https://doaj.org/article/4582b77ea0f945d8b98c83d3d0420884
Autor:
Ruppert, M.1 mathis.ruppert@ww.uni-erlangen.de, Böhm, W.2, Nguyen, H.2, Höppel, H.1, Merklein, M.2, Göken, M.1
Publikováno v:
Journal of Materials Science. Dec2013, Vol. 48 Issue 24, p8377-8385. 9p. 2 Black and White Photographs, 1 Chart, 6 Graphs.
Publikováno v:
Journal of Adhesion Science & Technology. 12/2/2002, Vol. 16 Issue 14, p1931-1948. 18p.
Autor:
Su, Mei-Ni1 Meini.su@manchester.ac.uk, Young, Ben2 ben.young@polyu.edu.hk
Publikováno v:
Thin-Walled Structures. Apr2019, Vol. 137, p463-471. 9p.
Autor:
Mattila, T., Zunger, Alex
Publikováno v:
Journal of Applied Physics. 1/1/1999, Vol. 85 Issue 1, p160. 8p. 1 Diagram, 5 Charts, 4 Graphs.
Autor:
Albedah, Abdulmohsen1 albedah@ksu.edu.sa, Bouiadjra, B. Bachir1,2, Benyahia, Faycal1, Mohammed, Sohail M.A. Khan1,3
Publikováno v:
International Journal of Adhesion & Adhesives. Dec2018, Vol. 87, p22-30. 9p.
Publikováno v:
Thin-Walled Structures. Mar2018, Vol. 124, p303-311. 9p.
Publikováno v:
Materials Transactions; 2021, Vol. 62 Issue 12, p1724-1731, 8p
Autor:
Casalino, Giuseppe1 giuseppe.casalino@poliba.itpasquale.guglielmi@poliba.it, D'Ostuni, Sonia2 sonia.dostuni@unisalento.it, Guglielmi, Pasquale1 gianfranco.pAlumbo@poliba.it, Leo, Paola2 paola.leo@unisalento.it, Palumbo, Gianfranco1 antonio.piccininni@poliba.it, Piccininni, Antonio1
Publikováno v:
Materials (1996-1944). Nov2018, Vol. 11 Issue 11, p2337. 1p. 9 Diagrams, 7 Charts, 6 Graphs.
Autor:
Cooke, Kavian O., Atieh, Anas M.
Publikováno v:
Journal of Manufacturing & Materials Processing; Jun2020, Vol. 4 Issue 2, p1-21, 21p