Zobrazeno 1 - 10
of 152
pro vyhledávání: '"Zwolinski, Mark"'
Many cache designs have been proposed to guard against contention-based side-channel attacks. One well-known type of cache is the randomized remapping cache. Many randomized remapping caches provide fixed or over protection, which leads to permanent
Externí odkaz:
http://arxiv.org/abs/2405.20027
Autor:
Xue, Bing, Zwolinski, Mark
Reliability has been a major concern in embedded systems. Higher transistor density and lower voltage supply increase the vulnerability of embedded systems to soft errors. A Single Event Upset (SEU), which is also called a soft error, can reverse a b
Externí odkaz:
http://arxiv.org/abs/2405.12089
Publikováno v:
In Microprocessors and Microsystems March 2021 81
Burn-in is accepted as a way to evaluate ageing effects in an accelerated manner. It has been suggested that burn-in stress may have a significant effect on the Negative Bias Temperature Instability (NBTI) of subthreshold CMOS circuits. This paper an
Externí odkaz:
http://arxiv.org/abs/1510.01370
Ultra Deep-Sub-Micron CMOS chips have to function correctly and reliably, not only during their early post-fabrication life, but also for their entire life span. In this paper, we present an architectural-level in-field repair technique. The key idea
Externí odkaz:
http://arxiv.org/abs/1509.09249
With the increasing complexity of computing systems, complete hardware reliability can no longer be guaranteed. We need, however, to ensure overall system reliability. One of the most important features of artificial neural networks is their intrinsi
Externí odkaz:
http://arxiv.org/abs/1509.09199
Publikováno v:
In Integration September 2019 68:12-21
Autor:
Thapliyal, Himanshu, Zwolinski, Mark
Differential Power Analysis (DPA) presents a major challenge to mathematically-secure cryptographic protocols. Attackers can break the encryption by measuring the energy consumed in the working digital circuit. To prevent this type of attack, this pa
Externí odkaz:
http://arxiv.org/abs/cs/0610089
Publikováno v:
In Microelectronics Reliability December 2017 79:79-90
Publikováno v:
In Microelectronics Reliability January 2016 56:189-201