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Publikováno v:
2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
One lidless CPU product failed more than 20% of visual inspections due to foreign material near the capacitor electrodes during testing production. This paper presents the analysis method for the foreign material, formation mechanism of dendrites, ve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fcbfd017b70c6475c695e56c4004ec2a
https://doi.org/10.1109/ipfa.2012.6306253
https://doi.org/10.1109/ipfa.2012.6306253
