Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Zongxiang, Yao"'
Publikováno v:
Journal of Electronic Materials. 52:3321-3333
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d00af59435f83f63ca545c41a453a889
https://doi.org/10.1007/s11664-023-10304-1
https://doi.org/10.1007/s11664-023-10304-1
Autor:
Sensen Chai, Shiyu Zhong, Qingshan Yang, Daliang Yu, Qingwei Dai, Hehe Zhang, Limeng Yin, Gang Wang, Zongxiang Yao
Publikováno v:
Journal of Materials Science & Technology. 120:108-117
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60df66c5882f25af38eb71a3512f3781
https://doi.org/10.1016/j.jmst.2022.01.005
https://doi.org/10.1016/j.jmst.2022.01.005
Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys
Publikováno v:
Journal of Electronic Materials. 51:3552-3559
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14a5dacbc4db8273503ef7beecae19c7
https://doi.org/10.1007/s11664-022-09601-y
https://doi.org/10.1007/s11664-022-09601-y
Autor:
Long Zhang, Hehe Zhang, Limeng Yin, Gang Wang, Zilong Su, Yupeng Zhang, Zongxiang Yao, Zhongwen Zhang, Cunguo Zuo
Publikováno v:
Journal of Electronic Materials. 49:7394-7399
Low silver Sn-0.3Ag-0.7Cu (SAC0307) composite solder reinforced with graphene nanosheets (GNs) was prepared by powder metallurgy techniques, and the effects of GN content on the melting characteristics, wettability, microhardness and shear strength o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a461848aedb897c109d17c3b97cdf410
https://doi.org/10.1007/s11664-020-08537-5
https://doi.org/10.1007/s11664-020-08537-5
Publikováno v:
Welding in the World. 64:2101-2108
Lead-free “copper wire/Sn-3.0Ag-0.5Cu (SAC305) solder/copper wire” sandwich-structured micro-scale solder joints with a constant diameter (d = 400 μm) and various heights (125, 225, and 325 μm) were adopted to carried out the mechanical behavio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36ad7747029764002c9d63f4cec0152e
https://doi.org/10.1007/s40194-020-00985-1
https://doi.org/10.1007/s40194-020-00985-1
Publikováno v:
Journal of Electronic Materials. 49:5391-5398
In order to discuss the effects of Cu-cored solder with pure Ni coating and joint height on the interfacial microstructure and mechanical properties of joints, Cu/Sn-3.0Ag0.5Cu (SAC305)/Cu and Cu/Cu-cored + SAC305/Cu sandwich solder joints were prepa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bca03537eaed05fc49bb24ad7ccea34
https://doi.org/10.1007/s11664-020-08273-w
https://doi.org/10.1007/s11664-020-08273-w
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:5462-5470
The tensile creep properties of line-type Cu/Sn–0.3Ag–0.7Cu(SAC0307)–xNi (x = 0, 0.02, 0.05 and 0.10 wt%)/Cu solder micro-joints were comparatively investigated via dynamic mechanical analysis. The effect of Ni content on the creep behaviour of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ec0a8b16c20057049eccbdbbdf15895
https://doi.org/10.1007/s10854-020-03109-z
https://doi.org/10.1007/s10854-020-03109-z
Autor:
Long Zhang, Dengjie Xiong, Zilong Su, Junfeng Li, Limeng Yin, Zongxiang Yao, Gang Wang, Liping Zhang, Hehe Zhang
Publikováno v:
Materials Today Communications. 33:104301
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7175376e24915475bba31943038c286e
https://doi.org/10.1016/j.mtcomm.2022.104301
https://doi.org/10.1016/j.mtcomm.2022.104301
Autor:
Hehe Zhang, Xuexi Zhang, Yuchen Xiao, Man Yang, Ziqi Xu, Zongxiang Yao, Mingfang Qian, Liping Zhang, Limeng Yin, Dongyong Jia
Publikováno v:
Intermetallics. 149:107651
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5dd17dc9de49b024817c85944a0676e2
https://doi.org/10.1016/j.intermet.2022.107651
https://doi.org/10.1016/j.intermet.2022.107651
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:1861-1867
Low silver Sn–0.3Ag–0.7Cu (SAC0307) solders with different amounts of graphene nanosheets (GNSs) prepared by powder metallurgy were used to investigate the impacts of GNSs on the microstructures, melting temperature, wettability, and tensile stre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c953d451e897cb9a7a583d3f44cca993
https://doi.org/10.1007/s10854-019-02705-y
https://doi.org/10.1007/s10854-019-02705-y