Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Zongchang Yu"'
Publikováno v:
DTCO and Computational Patterning II.
Autor:
Junwei Lu, Seung-Hoon Park, Kyung Kang, Stefan Hunsche, Yu Cao, Fei Du, John Barbuto, Zongchang Yu, Zhengfan Zhang, Chris Park, Jong-Ho Lim, Wenjin Shao, Sung-Man Kim, Venu Vellanki, Ronald Goossens
Publikováno v:
SPIE Proceedings.
Proximity matching is a common activity in the wafer fabs 1,2,3 for purposes such as process transfer, capacity expansion, improved scanner yield and fab productivity. The requirements on matching accuracy also become more and more stringent as CD er
Publikováno v:
SPIE Proceedings.
At 65nm technology node and below, with the ever-smaller process window, it is no longer sufficient to apply traditional model-based verification at only the nominal condition. Full-chip, full process-window verification has started to integrate into
Autor:
Christopher J. Progler, Patrick M. Martin, Zongchang Yu, Rick Gray, Bryan S. Kasprowicz, Young-Mog Ham, James N. Wiley, Jun Ye
Publikováno v:
SPIE Proceedings.
Lithography simulation is an integral part of semiconductor manufacturing. It is not only required in lithography process development, but also in RET design, RET verification, and process latitude analysis, from library cells to full-chip tape out.
Autor:
Carl Hess, Wayne Ruch, Zongchang Yu, Z. Mark Ma, Lisa Fisher, William Volk, Weimin Ma, Carl Albert Vickery
Publikováno v:
SPIE Proceedings.
With expected implementation of low k1 lithography on 193nm scanners for 65nm node wafer production, high resolution defect inspection will be needed to insure reticle quality and reticle manufacture process monitoring. Reticle cost and reticle defec
Autor:
Yalin Xiong, Sterling G. Watson, Zhian Guo, Hector I. Garcia, Zongchang Yu, Lantian Wang, William Volk
Publikováno v:
SPIE Proceedings.
Contacts and VIAs are features whose integrity are very susceptible to reticle CD defects or in general, to defects that produce a change of total energy (flux) projected through the reticle. As lithography is extended beyond the 130nm node, the prob
Publikováno v:
SPIE Proceedings.
For alternating aperture phase shift masks (AAPSM) and 193 nm (ArF) lithography, we have simulated defect printability using inspection images and software-based modeling. Masks were fabricated by DuPont Photomasks with programmed defects of known si
Autor:
Lantian Wang, Yalin Xiong, Zhian Guo, Sterling G. Watson, Hector I. Garcia, Zongchang Yu, William Volk
Publikováno v:
SPIE Proceedings.
With growing implementation of low k1 lithography on DUV scanners for wafer production, detecting and analyzing photomask critical dimension (CD) errors and semitransparent defects is vital for qualifying photomasks to enable high IC wafer yields for
Autor:
Paul van Adrichem, Fei Du, Youri van Dommelen, Rafael Aldana, Keith Gronlund, Roel Knops, Robert John Socha, Henry Meggens, Ronald Goossens, Venu Vellanki, Justin Gau, Dorothe Oorschot, Stephen Hsu, Koen Schreel, Wenjin Shao, Liesbeth Reijnen, Luoqi Chen, Zongchang Yu, Xu Xie
Publikováno v:
Japanese Journal of Applied Physics. 50:06GB01
FlexRay programmable illumination and LithoTuner software is combined in several use cases. The first use case is source mask optimization (SMO) in which the process window is maximized for a static random access memory (SRAM) design. In a 55 nm half