Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Zong Bo Zhang"'
Autor:
Jian Qin, Na Wu, Wei Chen, Bowen Liu, Zhenguo Wang, Lianping Zhang, Ni Yin, Qi Chen, Zong‐Bo Zhang, Chang‐Qi Ma
Publikováno v:
Small Methods.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b68e9441dcef2eec3c8b1b5e81b4654
https://doi.org/10.1002/smtd.202300224
https://doi.org/10.1002/smtd.202300224
Autor:
Wen-Yue Wang, Yu-Lin Zhang, Xiang Guo, Li-Ming Wang, Jun-Rong Zhang, Hui Yang, Guo-Jun Dong, Zong-Bo Zhang, Cai-Hong Xu
Publikováno v:
Chinese Journal of Polymer Science.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1de756ee4f8a118c2d22654680796bcb
https://doi.org/10.1007/s10118-023-2959-6
https://doi.org/10.1007/s10118-023-2959-6
Publikováno v:
International Journal of Heat and Mass Transfer. 204:123830
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cacd132a9a6813ba92b6983aa3856abb
https://doi.org/10.1016/j.ijheatmasstransfer.2022.123830
https://doi.org/10.1016/j.ijheatmasstransfer.2022.123830
Research on Moment Amplitude Modulation Coefficient of Unbonded Prestressed Concrete Continuous Beam
Publikováno v:
2021 7th International Conference on Hydraulic and Civil Engineering & Smart Water Conservancy and Intelligent Disaster Reduction Forum (ICHCE & SWIDR).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aedbcb77691a813c3765612ef737d828
https://doi.org/10.1109/ichceswidr54323.2021.9656276
https://doi.org/10.1109/ichceswidr54323.2021.9656276
Publikováno v:
Microsystem Technologies. 21:1101-1110
A new technique was developed for embossing microstructures on thermoplastic substrates, which can achieve high accuracy replication with little loss of the production efficiency. The technique is no need of the preheating process and cooling device.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08c489118821cbbd8381a36dae240042
https://doi.org/10.1007/s00542-014-2306-5
https://doi.org/10.1007/s00542-014-2306-5
Publikováno v:
Applied Mechanics and Materials. :1985-1988
During the near-field acoustic holographic reconstruction with sampling GREEN’s function in k space, there will be aliasing which results in the wrapping error for the infinite extension of GREEN’s function in real space. The magnitude of wrappin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb4096daec6f9ae81aadd48e86f96cad
https://doi.org/10.4028/www.scientific.net/amm.599-601.1985
https://doi.org/10.4028/www.scientific.net/amm.599-601.1985
Publikováno v:
Applied Mechanics and Materials. 607:133-138
Based on the theoretical study in our previous work, a novel thermal assisted ultrasonic bonding method for polymer Micro/nanoElectro-Mechanical Systems (M/NEMS) has been demonstrated. Bonding experiments of PMMA microfluidic chips with micro-channel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21e9588ff56ea23f87ad8f33fed84c03
https://doi.org/10.4028/www.scientific.net/amm.607.133
https://doi.org/10.4028/www.scientific.net/amm.607.133
Autor:
Zong-bo Zhang, Xiao-yang Liu, Da-wei Li, Tian-tian Gao, Yu-qi Lei, Bao-gui Wu, Jia-wei Zhao, Yan-kui Wang, Ling Wei
Publikováno v:
Carbon. 144:841
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d71204c59ac204befdc4bb21a0320a9
https://doi.org/10.1016/j.carbon.2018.11.090
https://doi.org/10.1016/j.carbon.2018.11.090
Publikováno v:
Key Engineering Materials. 483:311-315
Ultrasonic fusion bonding is a potential method for mass-production of polymer microfluidic chips. However, the micro structures in the chips are easily damaged or even destroyed due to poor controllability and uniformity of the melted energy directo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83f269aa617c3ff137d7b694ead3d188
https://doi.org/10.4028/www.scientific.net/kem.483.311
https://doi.org/10.4028/www.scientific.net/kem.483.311
Publikováno v:
Microsystem Technologies. 16:2043-2048
Because of extremely small dimensions of nanochannels and low rigidity of polymer, most bonding techniques which are suitable for sealing polymer microscale channels (width and depth in tens to hundreds microns) are not competent for bonding of polym
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c70202595333ff27c94018f227398dab
https://doi.org/10.1007/s00542-010-1140-7
https://doi.org/10.1007/s00542-010-1140-7