Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

Autor: Oosterhuis, G., Veld, B.H. in 't, Ebberink, G., Del Cerro, D.A., Eijnden, E. van den, Chall, P., Zon, B. van der

Publikováno v: 2nd IEEE International 3D System Integration Conference, 3DIC 2010, 16 November 2010 through 18 November 2010, Munich. Conference code: 84816

Laser Induced Forward Transfer (LIFT) is a single step, dry deposition process which shows great potential for interconnect fabrication. TNO, in cooperation with ALSI and University of Twente have studied the feature size and resistivity of copper st

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