Zobrazeno 1 - 10
of 86
pro vyhledávání: '"Zoltán Gácsi"'
Publikováno v:
Results in Engineering, Vol 23, Iss , Pp 102452- (2024)
Despite numerous recent technological developments, conventional powder metallurgy (CPM) remains the most commonly applied technique for fabricating stainless-steel products. However, the compressibility of stainless-steel powders is still a critical
Externí odkaz:
https://doaj.org/article/19b6ff2db3cb46a38e8e1c597c519cc7
Publikováno v:
Journal of Materials Research and Technology, Vol 24, Iss , Pp 8320-8331 (2023)
The Sn–3.0wt.%Ag–0.5wt.%Cu(SAC305) - xSiC composite solder was prepared by powder metallurgy method with the addition of SiC ceramic reinforcement with various compositions (0, 0.5, 1, and 1.5wt.%). The IMC layer thickness of Cu3Sn and Cu6Sn5 was
Externí odkaz:
https://doaj.org/article/932dd27b59e644f3b515683a43563e18
Publikováno v:
Metallography, Microstructure, and Analysis. 11:774-789
Porosity plays an important role in the properties of powder metallurgy products and castings. Nowadays, there are several methods for determining porosity: optical microscopy, computed tomography, and density measurement according to Archimedes’ p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41c5463b320881f74a9d21eb905c0276
https://doi.org/10.1007/s13632-022-00892-5
https://doi.org/10.1007/s13632-022-00892-5
Publikováno v:
Powder Metallurgy and Metal Ceramics. 58:529-537
In the present study, an electroless nickel (EN) plating method is applied for the coating of silicon carbide (SiC) particles. The particles of SiC(Ni) were added to the Sn–3.0Ag–0.5Cu matrix for the production of SAC305/SiC(Ni) composite by the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d31da2e4d2e13632f7f7013445575f3a
https://doi.org/10.1007/s11106-020-00107-y
https://doi.org/10.1007/s11106-020-00107-y
Publikováno v:
Science Progress. 106:003685042211460
The press and sinter method remains the standard among powder metallurgy processes for powdered stainless-steel materials. It delivers low cost, low oxidation rate, and adequate corrosion resistance. Furthermore, 17-4PH is a martensitic stainless-ste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2038f7fbdf5e9929178cfcb9e73dbe2d
https://doi.org/10.1177/00368504221146060
https://doi.org/10.1177/00368504221146060
Publikováno v:
Resolution and Discovery. 4:1-6
In this paper, the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by 2 different solder methods, which are the most common solder material...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7369871a0669a466ba406afb96aa2b3
https://doi.org/10.1556/2051.2019.00058
https://doi.org/10.1556/2051.2019.00058
Publikováno v:
Applied Surface Science. 475:982-985
Good wetting, strong bonding and low electrical resistance are the most important properties of the solder in microelectronic packaging. Aim of this study was to improve the mechanical and wetting properties of commercially available lead-free solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::137cdd7f367f9b5302580038e912e6c0
https://doi.org/10.1016/j.apsusc.2018.12.263
https://doi.org/10.1016/j.apsusc.2018.12.263
The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c60867e12fac53bda185a56d6a094b25
https://doi.org/10.21203/rs.3.rs-36424/v1
https://doi.org/10.21203/rs.3.rs-36424/v1
Publikováno v:
Journal of Alloys and Compounds. 894:162442
The kinetics of transformation of 5 w% TiB2 nano-particles (50 nm diameter) dispersed and pressed (1.5 GPa) in the of Ti matrix (150 µm diameter) into TiB nano-whiskers was studied as a function of temperature (800–900–1000 °C) and time (5–72
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94eaa6473321aea8a70993a9be11d2a6
https://doi.org/10.1016/j.jallcom.2021.162442
https://doi.org/10.1016/j.jallcom.2021.162442
Publikováno v:
Powder Metallurgy Progress. 18:49-57
The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and micro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a746ad3df862159dd85fc043c3646a3e
https://doi.org/10.1515/pmp-2018-0006
https://doi.org/10.1515/pmp-2018-0006