Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Zih-You Wu"'
Publikováno v:
Journal of Materials Research and Technology, Vol 20, Iss , Pp 1524-1532 (2022)
The Fe–Mn–Al–C lightweight steel has been widely studied due to its higher strength-to-weight ratio and potential applications for automotive vehicles, energy, transportation and mining industries. In general, the strength and ductility of the
Externí odkaz:
https://doaj.org/article/8b63576e584f4afba613af368c4d556d
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:3016-3023
Autor:
Pin-Wei Huang, Zih-You Wu, Yin-Ku Lee, Chen-Sung Chao, Su-Yueh Tsai, Shou-Yi Chang, Jenq-Gong Duh
Publikováno v:
Materials Chemistry and Physics. 298:127392
Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:22966-22972
For the advanced 3D-IC or 3D-packaging application, Cu-core solder joint is already a high reliability option for high power device and 3D packaging. However, with the harsher requirement for mechanical and electromigration reliability, it is imperat
Publikováno v:
Materials Chemistry and Physics. 291:126781