Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Zicheng Sa"'
Publikováno v:
Advanced Science, Vol 11, Iss 34, Pp n/a-n/a (2024)
Abstract Stretchable electrodes based on liquid metals (LM) are widely used in human‐machine interfacing, wearable bioelectronics, and other emerging technologies. However, realizing the high‐precision patterning and mechanical stability remains
Externí odkaz:
https://doaj.org/article/0383a3e5ed0b415ea6832d8908b1254d
Publikováno v:
Journal of Materials Research and Technology, Vol 26, Iss , Pp 9112-9126 (2023)
Nanotwinned copper (nt-Cu) is considered to be very desirable choice for a pad material in system-in-package (SiP) devices due to its excellent anti-electromigration and anti-element migration properties. However, complex diffusion reactions exist be
Externí odkaz:
https://doaj.org/article/1d27bfafcc9840988a3343cdfd99da34
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Electronic devices often work under a variety of vibration loads, especially for aerospace devices. For this reason, the reliability under vibration loading has become a critical problem of modern electronic devices. In recent years, the finite eleme
Autor:
Weiwei Zhang, Shang Wang, Zicheng Sa, Jiayun Feng, Yue Li, Yanhong Tian, He Zhang, Chunjin Hang
Publikováno v:
Materials Characterization. 180:111401
Micro resistance bonding is an essential method to bond micro metal wire and pad for the manufacturing of ever-miniaturized electronic components. However, the bonding quality is unstable due to the limited understanding of the interfacial phases. Na