Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Zi-Fan He"'
Publikováno v:
iScience, Vol 27, Iss 11, Pp 111136- (2024)
Summary: The evolution from subtractive to modified semi-additive (mSAP) and semi-additive (SAP) processes has heightened the importance of electroless plated (ELP) copper (Cu) peel strength in the printed circuit board industry. This study introduce
Externí odkaz:
https://doaj.org/article/2f0f785aff294440b3835412e952d732
Publikováno v:
ChemSusChem.
Publikováno v:
Journal of The Electrochemical Society. 166:A1668-A1670