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pro vyhledávání: '"Zhwen Chen"'
Autor:
Koji Sakui, Tadashi Fukuda, Young Suk Kim, Takayuki Ohba, Zhwen Chen, Takashi Obara, Tatsuji Kobayashi
Publikováno v:
IRPS
3D integration (3DI) with bumpless Wafer-on-Wafer (WOW) technology is expected to be one of the most promising methods for improving device performance. One of the key points of this technology is how to reduce the Si as thin as possible without degr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::531ff43754edac6fa141355d354b9e5e
https://doi.org/10.1109/irps46558.2021.9405125
https://doi.org/10.1109/irps46558.2021.9405125
