Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Zhuorui Tang"'
Autor:
Zhuorui Tang, Shibo Zhao, Jian Li, Yuanhui Zuo, Jing Tian, Hongyu Tang, Jiajie Fan, Guoqi Zhang
Publikováno v:
Case Studies in Thermal Engineering, Vol 59, Iss , Pp 104507- (2024)
This work addresses a novel technique for selecting the best process parameters for the 4H–SiC epitaxial layer in a horizontal hot-wall chemical vapor reactor using a transient multi-physical (thermal-fluid-chemical) simulation model and combined w
Externí odkaz:
https://doaj.org/article/173aa09a172844379ca29aa739baf492
Publikováno v:
Crystals, Vol 13, Iss 2, p 193 (2023)
The quality of the N-doped 4H-SiC homoepitaxial layers grown via hot-wall horizontal chemical vapor deposition (CVD) was evaluated at various C/Si ratios (1.0–1.2) and growth temperatures (1570–1630 °C). The microstructure and morphology of the
Externí odkaz:
https://doaj.org/article/b2274110c1704306adde97f0a2bf7953
Autor:
Zhuorui Tang, Lin Gu, Hongping Ma, Chaobin Mao, Sanzhong Wu, Nan Zhang, Jiyu Huang, Jiajie Fan
Publikováno v:
Crystals, Vol 13, Iss 1, p 62 (2022)
The homoepitaxial growth of 4H-SiC films was conducted on 4H-SiC 150 mm 4° off-axis substrates by using a home-made hot-wall chemical vapor deposition (CVD) reactor. Special attention was paid to the influence of the growth temperature on the surfac
Externí odkaz:
https://doaj.org/article/e2508b90af5e4229b4cb9acd0d6bc3f5
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the rel