Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Zhoulong Xu"'
Publikováno v:
IEEE Access, Vol 12, Pp 127149-127164 (2024)
Applying liquid-applied sound deadener (LASD) in the interiors of high-speed trains effectively reduces noise and vibration, thereby enhancing passenger comfort. Currently, the application of LASD relies on manual spraying methods, with the quality d
Externí odkaz:
https://doaj.org/article/a49d5b31690743c6b47fe872e7041a52
Publikováno v:
International Journal of Extreme Manufacturing, Vol 5, Iss 3, p 035002 (2023)
Direct ink writing (DIW) holds enormous potential in fabricating multiscale and multi-functional architectures by virtue of its wide range of printable materials, simple operation, and ease of rapid prototyping. Although it is well known that ink rhe
Externí odkaz:
https://doaj.org/article/54d0f0c9b52b499e90a17bfe31b2054f
Publikováno v:
Polymers, Vol 9, Iss 12, p 714 (2017)
Stretchable nanogenerators that directly generate electricity are promising for a wide range of applications in wearable electronics. However, the stretchability of the devices has been a long-standing challenge. Here we present a newly-designed ultr
Externí odkaz:
https://doaj.org/article/cd9c74a8bb4b4845ace1fc43dd4ee5b8
Publikováno v:
Polymers, Vol 9, Iss 9, p 434 (2017)
Micro/nano serpentine structures have widespread applications in flexible/stretchable electronics; however, challenges still exist for low-cost, high-efficiency and controllable manufacturing. Helix electrohydrodynamic printing (HE-printing) has been
Externí odkaz:
https://doaj.org/article/392d759430fe4449a76d5bfca79b906f
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1888-1896
Accuracy and efficiency of chip placement process play a critical role in electronic packaging technology since it can determine the success ratio and throughput of chip packaging system. In this paper, a new motional chip placement process is propos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c97c9ae1b0ccdfe0e39106474b72a6f
https://doi.org/10.1109/tcpmt.2019.2910186
https://doi.org/10.1109/tcpmt.2019.2910186
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1496-1506
Continuous peeling of thin chips and flexible devices from a donor to an acceptor is critical for high-efficiency roll-to-roll (R2R) manufacturing of flexible electronics. Here, we propose an R2R conformal peeling technique for the flexible device-on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e171384660aea0792008a25eaa39ef7
https://doi.org/10.1109/tcpmt.2018.2847342
https://doi.org/10.1109/tcpmt.2018.2847342
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:154-164
With the rapid growth of the microelectronic packaging market, it is necessary to increase the throughput and reduce the cost of flip chip. Driven by these evolutions, a novel revolving-turret chip transferring (RTCT) technology is introduced to impl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91202a2f6d1abc77af7f7878488bf1c5
https://doi.org/10.1109/tcpmt.2017.2760342
https://doi.org/10.1109/tcpmt.2017.2760342
Publikováno v:
Journal of Adhesion Science and Technology. 32:753-771
Nondestructively and efficiently peeling thin chip from the adhesive tape is still one of the crucial techniques in IC packaging technology. In order to improve the process efficiency, a novel appr...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36442240316add213a41911b5e91ead7
https://doi.org/10.1080/01694243.2017.1383336
https://doi.org/10.1080/01694243.2017.1383336
Publikováno v:
Science China Technological Sciences. 59:1646-1655
The serious warpage issues of ultrathin chip-on-flex (UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical pred
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6bf269605c195719903847574a2e0c13
https://doi.org/10.1007/s11431-016-0588-6
https://doi.org/10.1007/s11431-016-0588-6
Publikováno v:
Polymers; Volume 9; Issue 12; Pages: 714
Polymers, Vol 9, Iss 12, p 714 (2017)
Polymers
Polymers, Vol 9, Iss 12, p 714 (2017)
Polymers
Stretchable nanogenerators that directly generate electricity are promising for a wide range of applications in wearable electronics. However, the stretchability of the devices has been a long-standing challenge. Here we present a newly-designed ultr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::de11a97a3af2ce19d5a6cbde49441a75