Zobrazeno 1 - 10
of 243
pro vyhledávání: '"Zhou Guoyun"'
Autor:
Zhou, Guoyun, Li, Xiongyao, Li, Jiujuan, Wang, Shouxu, Yang, Ying, Wang, Chong, Hong, Yan, Chen, Yuanming, Han, Zhiwei, Li, Zhipeng
Publikováno v:
In Journal of Alloys and Compounds 5 September 2024 998
Autor:
Li, Jiujuan, Wen, Genshuo, He, Wei, Hong, Yan, Wang, Shouxu, Zhou, Guoyun, Wang, Chong, Zhang, Binbin, Huang, Haili, Li, Qinhua, Zhang, Renhui
Publikováno v:
In Materials Today Communications December 2024 41
Autor:
Han, Chuanyue, Zhai, Yuehui, Chen, Yuanming, Li, Jiujuan, Cai, Wenbin, Zhou, Zhiyou, Hong, Yan, Wang, Chong, Zhou, Guoyun
Publikováno v:
In Surface & Coatings Technology 30 May 2024 484
Autor:
Wu, Yijun, Wang, Chong, Han, Haiya, Li, Liang, Lai, Zhiqiang, Hong, Yan, Wang, Shouxu, Zhou, Guoyun, He, Wei, Chen, Yuanming, Li, Jiujuan, Fu, Wenfeng
Publikováno v:
In Journal of Materials Research and Technology May-June 2024 30:3831-3839
Autor:
Zhang, Weihao, Zhou, Guoyun, Hong, Yan, Chen, Xianming, Huang, Benxia, Xu, Xiaowei, Ding, Shuai, Zhu, Zhaojun, Huang, Yongmao, He, Wei
Publikováno v:
In Results in Physics May 2024 60
Autor:
Zhu Kai, Xing Ruimin, Jiang Zhongming, Zhong Rongjun, Chen Liuming, Liu Jianhui, Miao Hua, Zhou Guoyun
Publikováno v:
Reviews on Advanced Materials Science, Vol 63, Iss 1, Pp pp. 1-15 (2024)
The dimple of ball grid array (BGA) area with 70 mm × 70 mm size on load board for high performance integrated circuit final test is investigated by shadow moire at first, the dimple of BGA area decreases from 184.3 to 97.1 μm when six additional p
Externí odkaz:
https://doaj.org/article/ddac050c25e944b5b91553773a2e4aa8
Publikováno v:
In Sensors and Actuators: A. Physical 1 December 2023 363
Autor:
Shi, Huijuan, Zhou, Guoyun, Zhang, Qin, Wang, Pengju, Hong, Yan, He, Wei, Wang, Shouxu, Wang, Chong, Han, Zhiwei
Publikováno v:
In Journal of Industrial and Engineering Chemistry 25 October 2023 126:371-381
Autor:
Zhou, Guoyun, Luo, Yuxing, Hong, Yan, He, Wei, Wang, Shouxu, Chen, Yuanming, Wang, Chong, Tang, Yao, Sun, Yukai, Zhu, Yongkang, Li, Jiujuan
Publikováno v:
In Microelectronics Reliability March 2023 142
Autor:
Zou, Wenzhong, Zhou, Guoyun, Hong, Yan, He, Wei, Wang, Shouxu, Chen, Yuanming, Wang, Chong, Tang, Yao, Sun, Yukai, Ma, Chaoying
Publikováno v:
In Ceramics International 1 January 2023 49(1):84-94