Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Zhou, Zhangqiao"'
Publikováno v:
In Ceramics International 1 September 2024 50(17) Part A:29377-29387
Publikováno v:
In Journal of Magnetism and Magnetic Materials 15 July 2024 602
Autor:
Lin Tingyu, Guannan Yang, Chao Li, ChuMan Ho, Zhou Zhangqiao, Chengqiang Cui, Yang Bin, Hua Xiangang, Yu Zhang
Publikováno v:
Web of Science
As one of the four key basic materials in the field of microelectronic packaging, Bonding wire is the internal lead to realize the electrical interconnection between chip and lead frame. Its quality directly determines the performance of microelectro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aef6c513aa0d971af3f1194d1bb4d87a
https://doi.org/10.1109/icept50128.2020.9201943
https://doi.org/10.1109/icept50128.2020.9201943
Autor:
Li Chao, ChuMan Ho, Yang Bin, Guannan Yang, Zhou Zhangqiao, Hua Xiangang, Chengqiang Cui, Lin Tingyu, Yu Zhang
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
With excellent conductivity, ductility, reflectivity and low-cost advantages, silver bonding wire is a more competitive material which can replace the gold wire. It is widely used in display LED and storage fields. However, the key to the application
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4888f8b9b3b72cec4e47257d16fa306
https://doi.org/10.1109/icept50128.2020.9202913
https://doi.org/10.1109/icept50128.2020.9202913
Autor:
Chen Xun, Jian Gao, Xin Chen, Chengqiang Cui, Hui Tang, Yunbo He, Yun Chen, Zhou Zhangqiao, Yang Bin, Yu Zhang, Kai Zhang
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Silver bonding wire has excellent electrical conductivity, ductility and Reflective performance, the price is much lower than conventional gold wire, could be widely used in LED, IC and other fields. However, Silver bonding wire is very easy to react
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8da7a871db23cd5b53cd6589dc4ada0e
https://doi.org/10.1109/icept.2018.8480430
https://doi.org/10.1109/icept.2018.8480430